Abstract: The present invention relates to a technical field of CMP pad manufacture, and more particularly to a CMP layer based on porous cerium oxide and a preparation method thereof. The CMP layer of the present invention is formed by mixing and curing a polyurethane prepolymer, a crosslinking agent and the porous cerium oxide, including steps of preheating the polyurethane prepolymer under vacuum, then adding a porous cerium oxide filler to the polyurethane prepolymer, and thoroughly mixing to obtain a mixed prepolymer; moving the mixed prepolymer to a first tank, and performing heat preservation, stirring, and circulation treatments; adding the crosslinking agent to a second tank and performing a melting treatment; correcting an injection weight ratio of the first tank and the second tank, then rapidly mixing, so as to inject into the mold; and then curing and vulcanizing to obtain the polishing layer.

Abstract: A CMP (chemical mechanical polishing) groove processing positioning method includes steps of: (S1) preparing a positioning ring device for positioning a substrate of a polishing pad; (S2) placing the positioning ring device on a processing platform of an engraving machine; (S3) putting the substrate of the polishing pad into a slot of the positioning ring device; (S4) vacuum-adsorbing the substrate of the polishing pad onto the processing platform of the engraving machine through vacuum adsorption holes in the processing platform of the engraving machine; and (S5) placing an outer wall of the positioning ring device opposite to an outer wall of a disc of an engraving tool of an engraving machine, and engraving a groove on the substrate of the polishing pad. In the present invention, the substrate is directly placed into the slot and vacuum-adsorbed onto the processing platform through the vacuum adsorption holes, thereby sufficiently fixing the substrate.

Abstract: A CMP (chemical mechanical polishing) composite groove polishing pad includes a polishing pad substrate and has a rotation center located in a middle of the polishing pad substrate, a first groove, a second groove and a third groove; the first groove and the second groove are communicated with each other end to end to form a petal-shaped composite groove. The first groove includes at least two positive spiral logarithmic sub grooves each of which is a semicircular curve radially distributed along the polishing pad substrate, starts from the rotation center and ends with an edge of the polishing pad substrate. The second groove includes at least two negative spiral logarithmic sub grooves each of which is a reverse semicircular curve radially distributed along the polishing pad substrate, starts from the rotation center and ends with the edge of the polishing pad substrate.

Abstract: The present invention relates to a technical field of CMP pad manufacture, and more particularly to a CMP layer based on porous cerium oxide and a preparation method thereof. The CMP layer of the present invention is formed by mixing and curing a polyurethane prepolymer, a crosslinking agent and the porous cerium oxide, including steps of preheating the polyurethane prepolymer under vacuum, then adding a porous cerium oxide filler to the polyurethane prepolymer, and thoroughly mixing to obtain a mixed prepolymer; moving the mixed prepolymer to a first tank, and performing heat preservation, stirring, and circulation treatments; adding the crosslinking agent to a second tank and performing a melting treatment; correcting an injection weight ratio of the first tank and the second tank, then rapidly mixing, so as to inject into the mold; and then curing and vulcanizing to obtain the polishing layer.