Abstract: The present invention provides a thermally conductive silicone composition comprising: (A) at least one alkenyl group-containing organopolysiloxane; (B) at least one organohydrogenpolysiloxane having at least two hydrogen atoms directly bonded to a silicon atom in the molecule; (C1) one or more silane surface-treated alumina particles having a D50 particle size of at least 0.01 ?m but no greater than 5 ?m; (C2) one or more silane surface-treated alumina particles having a D50 particle size of greater than 5 ?m; (D) at least one silane coupling agent; and (E) at least one platinum-based curing catalyst; wherein component (C1) is present in an amount of less than 62% by weight based on the weight of the composition and the component (C2) is present in an amount of less than 80% by weight based on the weight of the composition, which features favorable combination of properties including good flowability, as well as high thermal conductivity and good lap shear strength when cured.

Abstract: The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 ?m and less than 3 ?m, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 ?m and less than 15 ?m, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 ?m and less than or equal to 100 ?m, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.

Abstract: The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

Abstract: The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

Abstract: The present invention relates to curable compositions comprising specific silicon-containing polymers, at least one vinyl carbosiloxane polymer, and at least a catalyst, cured products obtainable by heating such composition, and the use of said composition as semiconductor encapsulating material and/or electronic elements packaging material. More particularly, the invention relates to hydrosilylation-curable compositions that cure to form polycarbosiloxane products having optical clarity, resistance to high temperature, and very good moisture and gas barrier properties. This invention further relates to reliable light emitting devices encapsulated with these polycarbosiloxane compositions.

Abstract: The present invention relates to a liquid hydrosilicone resin and a preparation process thereof. The average composition of the liquid hydrosilicone resin is represented by the following formula: (R1R2R3SiO1/2)M.(R4R5SiO2/2)D. (R6SiO3/2)T.(SiO4/2)Q wherein R1 to R6 are identical or different radicals independently selected from the group consisting of organic groups and a hydrogen atom, with the proviso that at least one of R1to R6 is a hydrogen atom bonded directly to a silicon atom. The liquid hydrosilicone resin is obtained by dispersing a hydrosilicone oil, a hydroxyl silicone resin and a dehydrogenation catalyst in a solvent to form a dispersion, allowing the dispersion to react, and then removing the solvent and the catalyst.