Patents by Inventor Wentian Jin

Wentian Jin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240329117
    Abstract: Described herein is a hierarchical learning-based method, called HierPINN-EM, to solve the Korhonen equations for multi segment interconnects for fast EM failure analysis. HierPINN-EM split the physics laws into two levels and solve the PDE equations step by step. The lower level employs supervised learning to train a DNN model which takes parameterized neurons as inputs and serves as a universal parameterized EM stress solver for single segment wires. The upper level employs physics-informed loss function to train a separate DNN model at the boundaries of all wire segments to enforce the stress and atom flux continuities at internal junctions in interconnects.
    Type: Application
    Filed: October 30, 2023
    Publication date: October 3, 2024
    Applicant: The Regents of the University of California
    Inventors: Sheldon X. D. Tan, Wentian Jin