Patents by Inventor Wenwei (Victor) Wang

Wenwei (Victor) Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11626811
    Abstract: The present disclosure relates to an integrated boost modular multilevel converter, which has particular, but not sole, relevance to a converter for an inductive or capacitive (wireless) power transfer system. More particularly, the present invention according to an embodiment discloses a modular multilevel power converter (MMPC) comprising: at least one submodule stack having an output for connection to a load and an input for connection to an input power source, at least one inductive element provided between the input and the output, the at least one submodule stack including at least two submodules, each submodule comprising at least one capacitor and a plurality of controllable switches, and the submodules being operable to selectively transfer energy from the at least one inductive element to boost a voltage at the output relative to a voltage at the input.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: April 11, 2023
    Assignee: Auckland UniServices Limited
    Inventors: Baljit Singh Riar, Duleepa Jayanath Thrimawithana, Regan Andrew Zane, Wenwei (Victor) Wang