Patents by Inventor Wenwu PANG

Wenwu PANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-speed Cutting Device
    Publication number: 20230014163
    Abstract: A high-speed cutting device includes a mounting frame, a feeding mechanism, a linear chasing-cutting mechanism, an electrode guide plate, and an acceleration driving mechanism, the acceleration driving mechanism is provided on the discharging side of the electrode guide plate, and configured to perform acceleration driving on a material tape. The acceleration driving mechanism is provided behind the linear chasing-cutting mechanism to realize the acceleration driving of the material tape.
    Type: Application
    Filed: May 10, 2022
    Publication date: January 19, 2023
    Applicant: SHENZHEN GEESUN INTELLLIGENT TECHNOLOGY CO., LTD.
    Inventors: Panpan LI, Wenwu PANG, Shunnan CAO, Xueke WU, Rukun YANG