Patents by Inventor Wenwu Zhou

Wenwu Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12219937
    Abstract: The present disclosure relates to the field of artificial honeycombs, in particular to an artificial nest for solitary bees and an application method of the artificial nest. The artificial nest comprises a main enclosure tube, hanging rings, a plurality of trapping hollow tubes and tightening mechanisms used for clamping the trapping hollow tubes. The hanging rings are arranged at an outer sidewall of the main enclosure tube. The tightening mechanisms are annularly arranged at an inner sidewall of the main enclosure tube, and the trapping hollow tubes are fixed in a ring of each tightening mechanism in an axis direction of the main enclosure tube. Each tightening mechanism comprises a connecting steel wire and fastening springs. The sidewall of the main enclosure tube is provided with fixing holes for fixing the tightening mechanisms.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: February 11, 2025
    Assignees: ZHEJIANG UNIVERSITY, HAINAN INSTITUTE OF ZHEJIANG UNIVERSITY, HUZHOU PLANT PROTECTION QUARANTINE AND FERTILIZER MANAGEMENT STATION
    Inventors: Zengrong Zhu, Jin Lv, Xin Yuan, Wenwu Zhou, Ping Qian, Wendi Wu
  • Publication number: 20250015022
    Abstract: The present application provides a fabrication method for a semiconductor structure and a semiconductor structure. The fabrication method comprises: providing a structure to be wired, the structure comprising at least one chip, the chip having a front surface, and the front surface of the chip being provided with a plurality of solder pads; forming a first insulating layer on the front surface of the chip, the first insulating layer being provided with a plurality of openings, and each opening exposing at least part of one solder pad; forming a conductive film layer on the side of the first insulating layer distant from the chip; removing the part of the conductive film layer that exceeds the first insulating layer; and forming a rewiring structure on the side of the first insulating layer distant from the chip.
    Type: Application
    Filed: April 28, 2022
    Publication date: January 9, 2025
    Inventors: Yan HUO, Wenwu ZHOU
  • Publication number: 20230116999
    Abstract: The present disclosure relates to the field of artificial honeycombs, in particular to an artificial nest for solitary bees and an application method of the artificial nest. The artificial nest comprises a main enclosure tube, hanging rings, a plurality of trapping hollow tubes and tightening mechanisms used for clamping the trapping hollow tubes. The hanging rings are arranged at an outer sidewall of the main enclosure tube. The tightening mechanisms are annularly arranged at an inner sidewall of the main enclosure tube, and the trapping hollow tubes are fixed in a ring of each tightening mechanism in an axis direction of the main enclosure tube. Each tightening mechanism comprises a connecting steel wire and fastening springs. The sidewall of the main enclosure tube is provided with fixing holes for fixing the tightening mechanisms.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 20, 2023
    Applicants: ZHEJIANG UNIVERSITY, HAINAN INSTITUTE OF ZHEJIANG UNIVERSITY, HUZHOU PLANT PROTECTION QUARANTINE AND FERTILIZER MANAGEMENT STATION
    Inventors: Zengrong ZHU, Jin LV, Xin Yuan, Wenwu Zhou, Ping Qian, Wendi Wu