Patents by Inventor Wenxin LAN

Wenxin LAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single-sided light-emitting LED chips and fabrication method thereof
    Patent number: 10825960
    Abstract: Provided are a single-sided light-emitting LED chip and a fabrication method thereof. The single-sided light-emitting LED chip includes a highly reflective dielectric film and an LED including a substrate layer, an epitaxial layer, a cathode, and an anode. The LED has a substrate side, that is one surface of the substrate layer, and an electrode side opposite to each other, and the four sidewalls that respectively contacts the substrate side and the electrode side. The epitaxial layer is located on the other surface of the substrate layer; the cathode and the anode are located on a side of the epitaxial layer away from the substrate layer; and the four sidewalls of the LED are covered with the highly reflective dielectric film. The present invention simplifies the packaging process and improves the luminous efficiency of the packaged chip.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: November 3, 2020
    Assignees: Jiangxi Litkconn Optics Institute Technology Co., LTD, Shenzhen NiceUV Optics Co., Ltd.
    Inventors: Liangchen Wang, Zhaozhong Liu, Wenxin Lan, Hui Lin
  • SINGLE-SIDED LIGHT-EMITTING LED CHIPS AND FABRICATION METHOD THEREOF
    Publication number: 20200020832
    Abstract: Provided are a single-sided light-emitting LED chip and a fabrication method thereof. The single-sided light-emitting LED chip includes a highly reflective dielectric film and an LED including a substrate layer, an epitaxial layer, a cathode, and an anode. The LED has a substrate side, that is one surface of the substrate layer, and an electrode side opposite to each other, and the four sidewalls that respectively contacts the substrate side and the electrode side. The epitaxial layer is located on the other surface of the substrate layer; the cathode and the anode are located on a side of the epitaxial layer away from the substrate layer; and the four sidewalls of the LED are covered with the highly reflective dielectric film. The present invention simplifies the packaging process and improves the luminous efficiency of the packaged chip.
    Type: Application
    Filed: July 10, 2019
    Publication date: January 16, 2020
    Inventors: Liangchen WANG, Zhaozhong LIU, Wenxin LAN, Hui LIN