Abstract: A chip and a packaging method thereof. In the chip, first solder pads in a first solder pad array on a first substrate are attached to corresponding second pins in second pin arrays on different dies to implement short-distance and high-density interconnection of the different dies. A molding body is used to wrap a first pin, a second pin, a first solder pad, and the first substrate, so that a fan-out unit and the first substrate are molded into an integral structure. In the integral structure, bottoms of first pins that are in a first pin array on a die and that are electrically connected to a periphery of the chip are not wrapped by the molding body.

Abstract: A chip and a packaging method thereof. In the chip, first solder pads in a first solder pad array on a first substrate are attached to corresponding second pins in second pin arrays on different dies to implement short-distance and high-density interconnection of the different dies. A molding body is used to wrap a first pin, a second pin, a first solder pad, and the first substrate, so that a fan-out unit and the first substrate are molded into an integral structure. In the integral structure, bottoms of first pins that are in a first pin array on a die and that are electrically connected to a periphery of the chip are not wrapped by the molding body.

Abstract: A windshield wiper mounting plate supports a wiper relative to a frame of an all-terrain vehicle. The windshield is hinged to the frame, and the windshield wiper mounting plate is separately hinged to the frame. The windshield can be pivoted relative to the frame, simultaneously pivoting the windshield wiper mounting plate and attached wiper. The windshield is received in a windshield mounting groove of the windshield wiper mounting plate. The windshield can be removed from the frame by sliding the windshield out of the windshield mounting groove and while leaving the windshield wiper mounting structure attached to the frame of the all-terrain vehicle.

Abstract: A windshield wiper mounting plate supports a wiper relative to a frame of an all-terrain vehicle. The windshield is hinged to the frame, and the windshield wiper mounting plate is separately hinged to the frame. The windshield can be pivoted relative to the frame, simultaneously pivoting the windshield wiper mounting plate and attached wiper. The windshield is received in a windshield mounting groove of the windshield wiper mounting plate. The windshield can be removed from the frame by sliding the windshield out of the windshield mounting groove and while leaving the windshield wiper mounting structure attached to the frame of the all-terrain vehicle.

Abstract: The invention discloses a packaging structure, including a substrate, a fan-out unit, and a wiring layer. The fan-out unit includes a first chip and a second chip. The first chip includes a first pin array, and the second chip includes a second pin array. The fan-out unit further includes a third pin array. The first pin array, the second pin array, and the third pin array are all disposed facing the substrate. The wiring layer bridges over between the first pin array and the second pin array, and is configured to connect each first pin in the first pin array to a corresponding second pin in the second pin array. The substrate is provided with a soldering pad that is electrically connected to a wiring layer in the substrate, and the third pin array is connected to the soldering pad.