Patents by Inventor Wenxue Guo

Wenxue Guo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240157484
    Abstract: A full slag covering, spatter-free flux-cored welding wire, relating to the technical field of welding material formulations, which includes a flux core and a metal sheath, wherein the flux core is a slag system based on a neutral slag of calcium oxide-titanium dioxide-aluminum oxide; and molten drops are prevented from flying out to form spatters under the action of liquid slag in a welding process. The flux core is composed of rutile, fluoride, titanate, aluminum powder, manganese powder, chromium powder, molybdenum powder and iron powder, and mass percentages of respective components are: 15%-35% rutile, 15%-35% fluoride, 3%-7% calcium titanate, 5%-10% aluminum powder, 10%-20% manganese powder, 3%-5% chromium powder, 3%-15% molybdenum powder, and a remainder is iron powder or nickel powder. The present welding wire solves the technical problems of weld spatter and poor stability in the traditional welding process.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 16, 2024
    Inventors: Ning Guo, Xin Zhang, Changsheng Xu, Yanbo Tan, Wenxue Luo, Yunlong Fu
  • Publication number: 20240068087
    Abstract: The present disclosure provides a magnetron sputtering apparatus, including a process chamber, a bias power supply assembly, and an excitation power supply assembly. The process chamber is provided with a base assembly and a bias guide assembly. A target is arranged at a top of the process chamber. The base assembly is arranged at a bottom of the process chamber and is configured to support a wafer carrier, drive the wafer carrier to move, and heat the wafer carrier. The bias guide assembly is arranged at the base assembly and configured to support the wafer carrier. The bias guide assembly is electrically in contact with the wafer carrier. The bias power supply assembly is electrically connected to the bias guide assembly and configured to apply a bias voltage to the wafer carrier through the bias guide assembly.
    Type: Application
    Filed: December 21, 2021
    Publication date: February 29, 2024
    Inventors: Shubo WU, Yinggong MA, Shuaitao SHI, Wenxue XU, Bingliang GUO, Ziyang ZHEN, Lu ZHANG, Yaxin CUI, Hongtao ZHAI
  • Patent number: 9109079
    Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: August 18, 2015
    Assignee: ELANTAS GMBH
    Inventors: Klaus-W. Lienert, Ding Wang, Lixin Ye, Changshun Zhou, Wenxue Guo
  • Publication number: 20120045571
    Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.
    Type: Application
    Filed: February 1, 2010
    Publication date: February 23, 2012
    Applicant: ELANTAS GMBH
    Inventors: Klaus-W. Lienert, Ding Wang, Lixin Ye, Changshun Zhou, Wenxue Guo