Patents by Inventor Wenyao Zhai

Wenyao Zhai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9634717
    Abstract: Systems for a dual-band transceiver that re-uses a lower frequency transmitter to drive a local oscillator (LO) for high frequency circuits are disclosed herein. The need for a LO lineup requiring high frequency and high power is eliminated. The output of a lower frequency band is modified to be used as a LO drive for the higher frequency band transceiver. Using a carrier recovery loop, the system is operable to simultaneously operate in both bands. The result is a solution that eliminate the design of a high performance LO circuits for a higher band of a mmW dual-band system. This significantly reduces the overall complexity of the system. Furthermore, the inventive architecture reduces the design complexity and overall cost to implement dual-band circuit.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: April 25, 2017
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Wenyao Zhai
  • Patent number: 9531085
    Abstract: A dual-mode feed network for an antenna array or combination antenna is provided. Two transmission line structures propagate signals according to two different electromagnetic propagation modes, such as TE, TM, TEM and quasi TEM modes. The two transmission line structures are operatively coupled to different components of the antenna array. One transmission line structure may be a stripline or microstrip, and the other transmission line structure may be a waveguide such as a Substrate Integrated Waveguide. Both transmission line structures may branch to reach multiple elements of the antenna array. The transmission lines may share common features, for example by embedding the stripline within the waveguide.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: December 27, 2016
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Vahid Miraftab, Wenyao Zhai, Halim Boutayeb
  • Publication number: 20160277058
    Abstract: Systems for a dual-band transceiver that re-uses a lower frequency transmitter to drive a local oscillator (LO) for high frequency circuits are disclosed herein. The need for a LO lineup requiring high frequency and high power is eliminated. The output of a lower frequency band is modified to be used as a LO drive for the higher frequency band transceiver. Using a carrier recovery loop, the system is operable to simultaneously operate in both bands. The result is a solution that eliminate the design of a high performance LO circuits for a higher band of a mmW dual-band system. This significantly reduces the overall complexity of the system. Furthermore, the inventive architecture reduces the design complexity and overall cost to implement dual-band circuit.
    Type: Application
    Filed: March 20, 2015
    Publication date: September 22, 2016
    Inventor: Wenyao ZHAI
  • Publication number: 20160218438
    Abstract: A dual-mode feed network for an antenna array or combination antenna is provided. Two transmission line structures propagate signals according to two different electromagnetic propagation modes, such as TE, TM, TEM and quasi TEM modes. The two transmission line structures are operatively coupled to different components of the antenna array. One transmission line structure may be a stripline or microstrip, and the other transmission line structure may be a waveguide such as a Substrate Integrated Waveguide. Both transmission line structures may branch to reach multiple elements of the antenna array. The transmission lines may share common features, for example by embedding the stripline within the waveguide.
    Type: Application
    Filed: January 22, 2015
    Publication date: July 28, 2016
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Vahid Miraftab, Wenyao Zhai, Halim Boutayeb
  • Publication number: 20160204514
    Abstract: A Printed Circuit Board (PCB) comprising various integral components and method of manufacture are provided. The PCB includes a Substrate Integrated Waveguide (SIW), integrated waveguide antennas disposed above the SIW, apertures formed in SIW for coupling with the waveguide antennas, a transmission line routed above the SIW and using the SIW as a ground plane thereof, and further antennas, integrated into the PCB and disposed above and coupled to the transmission line. The SIW and the transmission line may be branched structures for feeding corresponding arrays of waveguide antennas and further antennas. Coplanar waveguides may also be integrated into the PCB and coupled to the SIW and the transmission line via integral impedance matching structures. PCB feature re-use and component interleaving may provide for a desirable and manufacturable PCB structure.
    Type: Application
    Filed: May 26, 2015
    Publication date: July 14, 2016
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Vahid MIRAFTAB, Wenyao ZHAI, Morris REPETA
  • Publication number: 20160204509
    Abstract: A combination antenna element is provided. A first antenna element, for example a waveguide antenna, may be coupled to a waveguide feed such as a Substrate Integrated Waveguide (SIW). The waveguide antenna may be formed as an aperture at a terminus of the SIW and disposed within a Printed Circuit Board (PCB) internal layer. A second antenna element, for example a microstrip patch antenna (MPA), may be provided on an outer PCB layer, the MPA defining an interior region, the interior region being positioned in line with the first antenna element. Also in some embodiments, the second antenna element is coupled to another antenna feed such as a transmission line feed which propagates signals in a different electromagnetic propagation mode than the waveguide. The transmission line feed may be a stripline located within the waveguide. An antenna array incorporating the combination antenna element is also provided.
    Type: Application
    Filed: January 12, 2015
    Publication date: July 14, 2016
    Inventors: Wenyao Zhai, Halim Boutayeb, Vahid Miraftab
  • Publication number: 20160172754
    Abstract: An embodiment antenna having first and second planar arrays. The first array has a first element spacing in an x-dimension and a y-dimension and is operable in a first frequency band. The second array has a second element spacing in the x-dimension and the y-dimension, and is operable in a second frequency band. The second planar array is displaced from the first planar array in a z-dimension for co-aperture operation of the arrays, and is disposed parallel to and in a near-field of the first planar array. Elements of the second planar array are disposed and steerable, in a u-v plane for interleaving a first plurality of grating lobes generated by the first planar array with a second plurality of grating lobes generated by the second planar array.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventor: Wenyao Zhai
  • Publication number: 20160156373
    Abstract: An embodiment millimeter wave diplexer includes a substrate integrated waveguide (SIW) high pass filter (HPF), a microstrip line low pass filter (LPF), and a T-junction. The SIW HPF is coupled to a first port, and the microstrip line LPF is coupled to a second port. The SIW HPF is operable in a first frequency band, and the microstrip line LPF is operable in a second frequency band. The T-junction is coupled between the SIW HPF and the microstrip line LPF. The T-junction is also coupled to a common port.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 2, 2016
    Inventors: Wenyao Zhai, Vahid Miraftab, Halim Boutayeb