Patents by Inventor Wen-Yi Wang
Wen-Yi Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961772Abstract: The present application relates to the field of semiconductor manufacturing technologies, and in particular to a method and an apparatus for automatically processing wafers. The method for automatically processing the wafers includes the following steps: providing several wafers, wherein the wafers operate on a primary path, and the primary path is a path for forming semiconductor structures on the surfaces of the wafers; determining whether there is a need for detecting defects of the wafers, and if yes, automatically switching an operating path of the wafers to a secondary path; detecting the defects of the wafers in the secondary path; and determining whether the defect detection on the wafers is finished, and if yes, automatically switching the operating path of the wafers to the primary path. The application makes it possible to automatically detect the defects of the wafers with different SWR conditions, thereby improving the automation degree of machines.Type: GrantFiled: June 24, 2021Date of Patent: April 16, 2024Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.Inventors: Peng Yang, Biao Gao, Li-Wei Wu, Wen-Yi Wang
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Publication number: 20240118313Abstract: A probe head includes upper, middle and lower dies having upper, middle and lower guiding holes respectively, and a plurality of spring probes. The spring probe includes upper and lower abutting sections disposed in the upper and lower guiding holes, a spring section connecting the upper and lower abutting sections, and a barrel disposed on the periphery of the spring section and inserted in the middle guiding hole. The spring probes include adjacent first and second probes whose barrels has first and second outer diameters and are accommodated in first and second middle guiding holes having first and second widths. The difference between the first width and outer diameter and/or the difference between the second width and outer diameter is larger than or equal to 10 micrometers, and/or the difference between the first and second outer diameters is larger than or equal to 5 ?m.Type: ApplicationFiled: October 5, 2023Publication date: April 11, 2024Applicant: MPI CORPORATIONInventors: WEI-CHENG KU, WEN-YI WANG, CHIH-WEI WEN
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Publication number: 20240075449Abstract: The application relates to a polymerization vessel and a method for manufacturing the same. An interior surface of the polymerization vessel has a specific structure, so that the polymerization vessel has better heat transfer efficiency. Closed cooling channels are constructed from the specific structure, and therefore cooling fluid flows in the closed cooling channels. Furthermore, there won't be any by-pass defects in the cooling channels of the polymerization vessel, thereby improving cooling efficiency of the cooling fluid.Type: ApplicationFiled: March 30, 2023Publication date: March 7, 2024Inventors: Ming-Hung CHENG, Fuh-Yih SHIH, Shih-Ming YEH, Wen-Yi WANG
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Publication number: 20230197535Abstract: The present application relates to the field of semiconductor manufacturing technologies, and in particular to a method and an apparatus for automatically processing wafers. The method for automatically processing the wafers includes the following steps: providing several wafers, wherein the wafers operate on a primary path, and the primary path is a path for forming semiconductor structures on the surfaces of the wafers; determining whether there is a need for detecting defects of the wafers, and if yes, automatically switching an operating path of the wafers to a secondary path; detecting the defects of the wafers in the secondary path; and determining whether the defect detection on the wafers is finished, and if yes, automatically switching the operating path of the wafers to the primary path. The application makes it possible to automatically detect the defects of the wafers with different SWR conditions, thereby improving the automation degree of machines.Type: ApplicationFiled: June 24, 2021Publication date: June 22, 2023Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.Inventors: Peng YANG, Biao GAO, LI-WEI WU, WEN-YI WANG
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Patent number: 9455705Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.Type: GrantFiled: May 12, 2014Date of Patent: September 27, 2016Assignee: WINTEK CORPORATIONInventors: Chi-Ming Huang, Shyh-Jeng Chen, Pei-Fang Tsai, Ming-Chuan Lin, Hsueh-Chih Wu, Wen-Hung Wang, Wen-Yi Wang
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Publication number: 20140332361Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.Type: ApplicationFiled: May 12, 2014Publication date: November 13, 2014Applicant: WINTEK CORPORATIONInventors: Chi-Ming Huang, Shyh-Jeng Chen, Pei-Fang Tsai, Ming-Chuan Lin, Hsueh-Chih Wu, Wen-Hung Wang, Wen-Yi Wang
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Publication number: 20120188184Abstract: A display having a frame, a touch display, and a method of manufacturing a frame are provided. The display includes a first frame, a second frame, and a display panel. The first frame includes a bottom surface, a sidewall, and a strengthened structure. The sidewall connects the bottom surface to define an accommodation space. The strengthened structure connects a terminal of the sidewall away from the bottom surface, is located at a side of the sidewall facing the accommodation space, and is substantially parallel to the sidewall. The strengthened structure has a contact surface. The contact surface faces the bottom surface and is substantially parallel to the bottom surface. The second frame is configured in the accommodation space and has a locking portion that has a locking surface leaning against the contact surface of the strengthened structure. The display panel is accommodated in the second frame.Type: ApplicationFiled: January 18, 2012Publication date: July 26, 2012Applicants: WINTEK CORPORATION, DONGGUAN MASSTOP LIQUID CRYSTAL DISPLAY CO., LTD.Inventors: Ming-Chuan Lin, Hsueh-Chih Wu, Ming-Che Chan, Wen-Yi Wang, Chao-Hsiang Chiang, Chu-Yu Yeh, Chao-Chi Liao
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Publication number: 20060034645Abstract: A magnetic roller sleeve for toner cartridge of printer, wherein the cylinder surface of the sleeve is covered with a coating layer comprising: one or more resins highly adhesive to the sleeve base material, one or more electric conducting materials, a plurality of additive agents capable of evenly distributing electric conducting materials and resins and enhancing the bond between the two, and more than one additive agents and diluting solvents that can control the adhesive time during coating in separate stage; with the unique coating of the surface layer on the magnetic roller sleeve, the life cycle and print quality of the magnetic roller sleeve can be effectively enhanced.Type: ApplicationFiled: August 11, 2004Publication date: February 16, 2006Inventors: Cheng Lee, Wen-Yi Wang
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Publication number: 20040082194Abstract: A method for coating a thick spin-on-glass layer on a semiconductor structure without cracking problems and with improved planarization is disclosed. In the method, a pre-processed semiconductor structure that has a plurality of metal lines on top is first provided. After a first conformal layer of silicon oxide is deposited on top to insulate the metal lines, a first and a second layer of SOG are coated on top to a total thickness of at least 2500 Å. On top of the second SOG layers, is then deposited a second layer of silicon oxide by a plasma enhanced oxide deposition technique to a thickness of at least 1000 Å. A third and a fourth SOG layer are then coated on top of the stress buffer layer to a total thickness of at least 2500 Å.Type: ApplicationFiled: October 29, 2002Publication date: April 29, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Wen-Yi Wang, Hsin-Chieh Huang
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Patent number: 6727184Abstract: A method for coating a thick spin-on-glass layer on a semiconductor structure without cracking problems and with improved planarization is disclosed. In the method, a pre-processed semiconductor structure that has a plurality of metal lines on top is first provided. After a first conformal layer of silicon oxide is deposited on top to insulate the metal lines, a first and a second layer of SOG are coated on top to a total thickness of at least 2500 Å. On top of the second SOG layers, is then deposited a second layer of silicon oxide by a plasma enhanced oxide deposition technique to a thickness of at least 1000 Å. A third and a fourth SOG layer are then coated on top of the stress buffer layer to a total thickness of at least 2500 Å.Type: GrantFiled: October 29, 2002Date of Patent: April 27, 2004Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Wen-Yi Wang, Hsin-Chieh Huang
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Publication number: 20020022262Abstract: The present invention relates to a type of plant tissue culture vessels which comprises a container and a cover, wherein the container is made of transparent synthetic polymers and has a opening, a stress concentration seams which be formed on the circumferential surface and/or bottom of the container and which can be focused the distribution of stresses in certain way that can be safely and easily avulsion before seedlings are removed from the culture vessel.Type: ApplicationFiled: August 3, 2001Publication date: February 21, 2002Inventors: Wen-Yi Wang, Hui-Chen Hsu
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Patent number: 6290413Abstract: A writing instrument includes a hollow barrel having a longitudinal slot defined through the barrel. The slot has two sides, and a series of continual indentations are formed in each side. A connecting device is slidably mounted in the barrel. A thrust device is mounted on the periphery of the barrel to drive the connecting device. The connecting device includes two opposite ends with a hollow, cylindrical connector attached to each end to connect to a crayon, a colored pencil or an eraser stick. Consequently, the writing instrument is easy to operate, never dirties the user's hands and can be used as an eraser or a double-color drawing pen.Type: GrantFiled: October 24, 2000Date of Patent: September 18, 2001Inventor: Wen-Yi Wang
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Patent number: 6199255Abstract: Apparatus for aiding in the disassembly of a mechanical assembly, such as an injector head having a plurality of interconnected, stacked plates. The apparatus includes a stationary base with side walls between which the plates are received to maintain registration of the latter during disassembly. A carriage slideably mounted on the base includes a clamp for clamping the head on the base and means for securing a portion of the head on the carriage such that the head portion moves along with the carriage. Through holes in the side walls allow certain of the plates to be secured to the side walls against movement of the carriage such that upward movement of the carriage separates the plates.Type: GrantFiled: October 6, 1999Date of Patent: March 13, 2001Assignee: Taiwan Semiconductor Manufacturing Company, LtdInventors: Wen-Yi Wang, Yi-Kun Chen, Chia-Hsin Lin, Wen-Tsam Chang
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Patent number: D401282Type: GrantFiled: October 3, 1997Date of Patent: November 17, 1998Inventor: Wen-Yi Wang