Patents by Inventor Wenyong YAN

Wenyong YAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Seamless back buckle with concealed fittings
    Patent number: 10555573
    Abstract: A seamless back buckle with concealed fittings, including a substrate and a plurality of rows of fittings disposed on the substrate; wherein the substrate includes a surface layer and a bottom layer, an interlayer is disposed between the surface layer and the bottom layer, and the plurality of rows of fittings are disposed in the interlayer; and a through hole is formed at a position corresponding to each fitting on the surface layer, and each through hole is communicated with an interior of the interlayer. A new concealed structure is adopted for the fittings of the back buckle, which provides a new idea for the underwear market, and can effectively simplify production procedures and reduce production costs.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: February 11, 2020
    Inventors: Sek Ho Yip, Wenyong Yan
  • SEAMLESS BACK BUCKLE WITH CONCEALED FITTINGS
    Publication number: 20190313721
    Abstract: A seamless back buckle with concealed fittings, including a substrate and a plurality of rows of fittings disposed on the substrate; wherein the substrate includes a surface layer and a bottom layer, an interlayer is disposed between the surface layer and the bottom layer, and the plurality of rows of fittings are disposed in the interlayer; and a through hole is formed at a position corresponding to each fitting on the surface layer, and each through hole is communicated with an interior of the interlayer. A new concealed structure is adopted for the fittings of the back buckle, which provides a new idea for the underwear market, and can effectively simplify production procedures and reduce production costs.
    Type: Application
    Filed: January 17, 2019
    Publication date: October 17, 2019
    Inventors: Sek Ho YIP, Wenyong YAN