Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.

Abstract: A method for making a probe card includes: mounting a plurality of probe needles on a probe-mounting seat; forming a conductive protective coating on tips of the probe needles; and bonding the probe needles to a printed circuit board through welding techniques after formation of the conductive protective coating on the tips of the probe needles.

Abstract: A treating method for a probe card in a vacuum deposition device, the probe card having a plurality of probes. The treating method includes: (a) preparing a shield body having a lower shield plate and an upper shield plate disposed above the lower shield plate and having a through hole; (b) placing the probe card into the shield body and between the lower and upper shield plates; (c) disposing the shielded probe card and the shield body into a vacuum deposition device such that at least a portion of each of the probes is exposed from the through hole, and that a circuit of the printed circuit board is shielded by the lower and upper shield plates; and (d) depositing at least one film on each of the probes through the through hole and within the vacuum deposition device.

Abstract: A method for making a probe card includes: mounting a plurality of probe needles on a probe-mounting seat; forming a conductive protective coating on tips of the probe needles; and bonding the probe needles to a printed circuit board through welding techniques after formation of the conductive protective coating on the tips of the probe needles.

Abstract: A probe installed to a probe card is provided. A tip or a body of the probe are electroplated with a conductive film and the probe card is placed in a vacuum electroplating furnace. Or, the body of the probe is electroplated with an insulating film and the probe card is placed in a vacuum electroplating furnace. Further, a probe with worn conductive film is electroplated again with a conductive film. The conductivity of the probe is increased and the probe is more worn-endurable and friction endurable. The dirt and dregs on the surface of the probe can be reduced. Electromagnetic interference is decreased and the probe can be trimmed easily. The probe is reused again and again and the lifetime of the probe is prolonged. The yield ratio is increased and the cost in testing is reduced.

Abstract: A cleaner for a test-card probe is made of fibers irregularly positioned and packed very close, shaped as flat board with a proper thickness. As the fiber has some elasticity so that a test-card probe may not be harmed or damaged when the probe is inserted in and pulled out of the cleaner.

Abstract: A treating method for probes positioned on a test card includes several steps for plating a layer of film of various materials according to different necessities on the tips or the portions of the probes before or after the probes on the test card is used, so that the tips of the probes may be repaired and plated again and again to let the probes increase their electric conductivity or insulating property and preventing electromagnetic interference. The materials of the layer of film may be metal, metal alloy or nonmetals.

Abstract: A switch-mode self-coupling power device additionally increases a set of high voltage auxiliary winding in the transformer and increases a control circuit and an energy transmitting circuit in the primary side circuit of the conventional circuit. When the load is too low, the control circuit may control the energy transmitting circuit according to the variation of the load so that the voltage of the high voltage auxiliary winding can be transmitted to a controller for operation through the energy transmitting circuit. Therefore, the design of PWM controller (pulse width modulation controller) auxiliary power circuit according to the present invention, which is not limited by the magnitude of a dummy load at the secondary side of the transformer, can conform to international regulations and is a product with industrial purpose and conforming to green mode.

Abstract: A method for treating a contaminated fluid includes: preparing biomass-carrier pieces made from a fiber component selected from a non-woven fabric, a fiber bundle assembly, a bulky fiber bundle assembly, a woven fabric, and a braided strap; and mixing the biomass-carrier pieces with the contaminated fluid, so as to remove the contaminated parts of the contaminated fluid. A system for treating a contaminated fluid, and a method for making a biomass carrier suitable for treating a contaminated fluid are also disclosed. The biomass carrier thus made has a minimum thickness region at a bonding line, so as to reinforce the structure of the biomass carrier, and a loose region surrounding the minimum thickness region, so as to improve attachment of microorganisms thereon and facilitate immersion into water.