Abstract: The present disclosure relates to a device and a system for testing flatness. The device for testing flatness includes a base, a testing platform, and a ranging sensor. The testing platform is assembled on the base. The testing platform includes a supporting structure. The supporting structure is disposed on the side of the testing platform away from the base and is used to support a to-be-tested board. The structure matches the structure of the to-be-tested board. The ranging sensor is disposed on the side of the testing platform away from the base. After the to-be-tested board is placed on the testing platform, the ranging sensor is used to test distances between a number N of to-be-tested positions on the to-be-tested board and the ranging sensor, to obtain N pieces of distance information, and the N pieces of distance information are used to determine the flatness of the to-be-tested board, where N is an integer greater than 2.

Abstract: A folding device is provided. The folding device includes a bearing and fixing mechanism (1) configured to bear and fix a main body portion (21) of a to-be-folded device (2); a folding mechanism (3) located on at least one side of the bearing and fixing mechanism (1), the folding mechanism (3) being rotatably connected to the bearing and fixing mechanism (1) and configured to bear and fix a to-be-folded portion (22) of the to-be-folded device (2); and a driving mechanism (4) connected to the folding mechanism (3), the driving mechanism (4) being configured to drive the folding mechanism (3) to turn relative to the bearing and fixing mechanism (1), so as to fold the to-be-folded portion (22) to a side in a thickness direction of the main body portion (21). The folding device can fold automatically, and manual folding is avoided.

Abstract: A folding device and a folding method are provided. The folding device includes a bearing and fixing mechanism configured to bear and fix a main body portion of a to-be-folded device; a folding mechanism disposed on at least one lateral side of the bearing and fixing mechanism, the folding mechanism being configured to bear a to-be-folded portion of the to-be-folded device and fold the to-be-folded portion to one side in a thickness direction of the main body portion; a first driving mechanism configured to drive the folding mechanism to move along a direction perpendicular to a bearing surface, which bears the main body portion, of the bearing and fixing mechanism; and a second driving mechanism configured to drive the folding mechanism to move close to or away from the bearing and fixing mechanism along a direction parallel to the bearing surface.

Abstract: A folding device is provided, The folding device includes a bearing and fixing mechanism (1) configured to bear and fix a main body portion (21) of a to-be-folded device (2); a folding mechanism (3) located on at least one side of the bearing and fixing mechanism (1), the folding mechanism (3) being rotatably connected to the bearing and fixing mechanism (1) and configured to bear and fix a to-be-folded portion (22) of the to-be-folded device (2); and a driving mechanism (4) connected to the folding mechanism (3), the driving mechanism (4) being configured to drive the folding mechanism (3) to turn relative to the bearing and fixing mechanism (1), so as to fold the to-be-folded portion (22) to a side in a thickness direction of the main body portion (21), The folding device can fold automatically, and manual folding is avoided.

Abstract: The present disclosure relates to a device and a system for testing flatness. The device for testing flatness includes a base, a testing platform, and a ranging sensor. The testing platform is assembled on the base. The testing platform includes a supporting structure. The supporting structure is disposed on the side of the testing platform away from the base and is used to support a to-be-tested board. The structure matches the structure of the to-be-tested board. The ranging sensor is disposed on the side of the testing platform away from the base. After the to-be-tested board is placed on the testing platform, the ranging sensor is used to test distances between a number N of to-be-tested positions on the to-be-tested board and the ranging sensor, to obtain N pieces of distance information, and the N pieces of distance information are used to determine the flatness of the to-be-tested board, where N is an integer greater than 2.

Abstract: The present disclosure provides a gas-solid separation structure including: a feeding pipeline including a first feeding part, a second feeding part and a first valve disposed between the first and second feeding parts; a discharge pipeline having a first opening and a second opening opposite to each other, the second feeding part extending into the discharge pipeline via the first opening; wherein an exhaust channel is formed between the second feeding part and the discharge pipeline, exhaust holes are formed in a portion of the discharge pipeline opposite to the second feeding part, and the exhaust channel is in communication with the exhaust holes. The present disclosure further provides a feeding device and an electrochemical deposition apparatus. The present disclosure can improve the problem of interference with medicine powder release caused by gases entering the discharge pipeline.

Abstract: Disclosed is an LED package, an LED module and a method for manufacturing the LED package. The LED package includes a lead frame comprising an insulating substrate and a plurality of first pins to a plurality of fourth pins formed on the insulating substrate, a plurality of first bonding pads to a plurality of fourth bonding pads, and a plurality of first wires to a plurality of fourth wires; a plurality of pixel units, each of which includes a first LED element, a second LED element and a third LED element; and an encapsulating composition covering the lead frame and allowing light to transmit. The LED package includes the plurality of LED elements of pixel units and implements internal interconnection with additional wires, thereby reducing the number of bonding pads of the LED package, and thus the manufacturing cost is reduced and the product reliability is improved.

Abstract: The present disclosure provides a mask repairing apparatus, a method for repairing a mask and an evaporation apparatus. The mask repairing apparatus includes: a repairing device configured to repair a portion of a mask to be repaired; and a moving mechanism installed within a region facing towards the mask and configured to drive the repairing device to move to a position which is opposite to the portion of the mask to be repaired.

Abstract: Disclosed are a chip on film and a display device. the chip on film includes a plurality of output pads independent from each other extending in the first direction on a side of a base material; correspondingly, a flexible display panel in the display device includes a plurality of input pads in one-to-one correspondance with output pads extending in the first direction in the bonding region. The chip on film can improve the bonding yield and stability of the display device.

Abstract: Display panel and display device, and fabrication methods are provided. The method for fabricating the display panel includes forming a protective layer at least on a bending region, the bending region being in a non-display region containing peripheral circuits of the display panel, to cover the peripheral circuits, and folding the display panel at the bending region towards a back surface of the display panel. When the display panel is folded at the bending region towards the back surface of the display panel, the protective layer coated on the bending region provides protection for the peripheral circuits formed on the surface of the bending region.

Abstract: Disclosed is an LED package, an LED module and a method for manufacturing the LED package. The LED package includes a lead frame comprising an insulating substrate and a plurality of first pins to a plurality of fourth pins formed on the insulating substrate, a plurality of first bonding pads to a plurality of fourth bonding pads, and a plurality of first wires to a plurality of fourth wires; a plurality of pixel units, each of which includes a first LED element, a second LED element and a third LED element; and an encapsulating composition covering the lead frame and allowing light to transmit. The LED package includes the plurality of LED elements of pixel units and implements internal interconnection with additional wires, thereby reducing the number of bonding pads of the LED package, and thus the manufacturing cost is reduced and the product reliability is improved.

Abstract: Display panel and display device, and fabrication methods are provided. The method for fabricating the display panel includes forming a protective layer at least on a bending region, the bending region being in a non-display region containing peripheral circuits of the display panel, to cover the peripheral circuits, and folding the display panel at the bending region towards a back surface of the display panel. When the display panel is folded at the bending region towards the back surface of the display panel, the protective layer coated on the bending region provides protection for the peripheral circuits formed on the surface of the bending region.

Abstract: The present disclosure provides a mask repairing apparatus, a method for repairing a mask and an evaporation apparatus. The mask repairing apparatus includes: a repairing device configured to repair a portion of a mask to be repaired; and a moving mechanism installed within a region facing towards the mask and configured to drive the repairing device to move to a position which is opposite to the portion of the mask to be repaired.

Abstract: Disclosed are a chip on film and a display device. the chip on film includes a plurality of output pads independent from each other extending in the first direction on a side of a base material; correspondingly, a flexible display panel in the display device includes a plurality of input pads in one-to-one correspondance with output pads extending in the first direction in the bonding region. The chip on film can improve the bonding yield and stability of the display device.

Abstract: A film thickness control system and a film thickness control method for an evaporation device, an evaporation device and an evaporation method are disclosed. The film thickness control system includes: a driving device, a film thickness meter and a computer; the film thickness meter is mounted on the driving device, connected with the computer, and configured to acquire a coordinate of a measured position of a substrate to be measured from the computer and send an actual film thickness of the measured position to the computer; and the computer is configured, when the actual film thickness does not exceed an error range of a preset film thickness, to calculate a new compensation value according to the actual film thickness, the preset film thickness and a current compensation value, and send the new compensation value to the evaporation device as reference for compensating evaporation.

Abstract: An evaporation apparatus is disclosed. The evaporation apparatus includes: an evaporation chamber; a carrier, disposed in the evaporation chamber and employed to bear a substrate onto which an evaporation material is to be evaporated; a longitudinal rail, fixed below the carrier; a first horizontal rail, connected with the longitudinal rail, the first horizontal rail being movable upwardly and downwardly along the longitudinal rail to come close to or move away from the carrier; and a heating source plate, disposed in the evaporation chamber, the heating source plate being movable onto the first horizontal rail and being movable upwardly and downwardly along with the first horizontal rail.