Patents by Inventor Wenzhao Liao

Wenzhao Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire fixation apparatus and soldering method
    Patent number: 11471967
    Abstract: A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: October 18, 2022
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., Measurement Sepcialties (China) Ltd., Shenzhen Ami Technology Co. Ltd.
    Inventors: Yingcong Deng, Jeffrey Rochette, Qiyu Cai, Yang Zhou, Wenzhao Liao, Yumin Lan, Yanbing Fu, Yun Liu, Dandan Zhang, Qinglong Zeng
  • Wire Fixation Apparatus And Soldering Method
    Publication number: 20200114447
    Abstract: A fixation apparatus includes a base, a wire fixing device mounted on the base, and a pressing device mounted on the base. The wire fixing device positions and fixes a wire on a circuit board and includes a fixing frame mounted on the base and a moving unit received in a receiving chamber of the fixing frame. The fixing frame has a first positioning groove. The moving unit is movable between a clamping position and a release position and has a second positioning groove coupled with the first positioning groove. The wire is inserted into a wire insertion hole in the circuit board between the first positioning groove and the second positioning groove when the mobile unit is moved to the release position. The wire is clamped and fixed between the first positioning groove and the second positioning groove when the moving unit is moved to the clamping position.
    Type: Application
    Filed: December 13, 2019
    Publication date: April 16, 2020
    Applicants: Tyco Electronics (Shanghai) Co. Ltd., Measurement Specialties (China) Ltd., Shenzhen AMI Technology Co., Ltd.
    Inventors: Yingcong Deng, Jeffrey Rochette, Qiyu Cai, Yang Zhou, Wenzhao Liao, Yumin Lan, Yanbing Fu, Yun Liu, Dandan Zhang, Qinglong Zeng