Patents by Inventor Wenzhe ZHENG

Wenzhe ZHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969943
    Abstract: A hot bed deformation tolerance structure for a large-sized continuous fiber high-temperature 3D printer is provided. Size changes caused by thermal expansion of a hot bed are compensated through motion coordination of a secured hot bed support assembly and a motion device, especially for an aluminum alloy material. A Z-direction motion structure of this structure is fixedly mounted with a frame and works at room temperature. A compensation motion module is fixedly mounted with a Z axis and incompletely secured with the hot bed support assembly, and works at room temperature with the Z axis. The hot bed support assembly is incompletely secured and partially in a high-temperature chamber, with a maximum working temperature of 300° C. The hot bed support assembly retains motion redundancy in a direction of thermal expansion deformation, tolerates thermal deformation through a linear motion module, and compensates for metal deformation through horizontal motion coordination.
    Type: Grant
    Filed: December 12, 2023
    Date of Patent: April 30, 2024
    Assignee: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
    Inventors: Yiwei Chen, Jinghua Zheng, Zhongde Shan, Wenzhe Song, Congze Fan, Hao Zhang
  • Publication number: 20240135737
    Abstract: Described herein are systems, methods, and instrumentalities associated with automatically annotating a 3D image dataset. The 3D automatic annotation may be accomplished based on a 2D manual annotation provided by an annotator and by propagating, using a set of machine-learning (ML) based techniques, the 2D manual annotation through sequences of 2D images associated with the 3D image dataset. The automatically annotated 3D image dataset may then be used to annotate other 3D image datasets upon passing a readiness assessment conducted using another set of ML based techniques. The automatic annotation of the images may be performed progressively, e.g., by processing a subset or batch of images at a time, and the ML based techniques may be trained to ensure consistency between a forward propagation and a backward propagation.
    Type: Application
    Filed: March 29, 2023
    Publication date: April 25, 2024
    Applicant: Shanghai United Imaging Intelligence Co., Ltd.
    Inventors: Meng Zheng, Wenzhe Cui, Ziyan Wu, Arun Innanje, Benjamin Planche, Terrence Chen
  • Publication number: 20240106235
    Abstract: A high anti-interference microsystem based on System In Package (SIP) for a power grid is provided. The high anti-interference microsystem comprises a ceramic cavity, a ceramic substrate, a magnetic cover plate, a digital signal processing circuit, an analog signal conditioning circuit and a shield, wherein the ceramic cavity supports the ceramic substrate, the magnetic cover plate is in sealed contact with the ceramic cavity, and the ceramic substrate is arranged in a cavity formed by the ceramic cavity and the magnetic cover plate; a sealed shell of the microsystem based on SIP is composed of the magnetic cover plate and the ceramic cavity; the digital signal processing circuit and the analog signal conditioning circuit are arranged on the ceramic substrate and respectively process received signals to be processed; the shield covers an outer side of the sealed shell and is used for shielding external magnetic field interference.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 28, 2024
    Applicant: Electric Power Research Institute of State Grid Zhejiang Electric Power Co., LTD
    Inventors: Xianjun SHAO, Xiaoxin CHEN, Yiming ZHENG, Chen LI, Jianjun WANG, Ping QIAN, Hua XU, Shaoan WANG, Shaohe WANG, Haibao MU, Huibin TAO, Lin ZHAO, Wenzhe ZHENG, Dun QIAN
  • Patent number: 11926098
    Abstract: A wire feeding mechanism suitable for fused deposition Additive Manufacturing (AM) of a flexible wire is provided, which includes a support housing. A melting nozzle is arranged at the lower end of the support housing, a hook is connected to the inner wall of the top end of the support housing, a connecting rod is connected to the inner wall of one side of the support housing, a wire drawing mechanism is connected to one end of the connecting rod, the wire drawing mechanism is located at the lower end of the hook, a limiting mechanism and a wire guide mechanism are connected to the inner wall of one side of the support housing, the limiting mechanism is located at the lower end of the wire drawing mechanism, the wire guide mechanism is located at the lower end of the limiting mechanism.
    Type: Grant
    Filed: September 7, 2023
    Date of Patent: March 12, 2024
    Assignee: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
    Inventors: Zhongde Shan, Congze Fan, Wenzhe Song, Yiwei Chen, Jinghua Zheng, Linlin Luo
  • Patent number: 11911961
    Abstract: An additive manufacturing device for an aerospace truss includes a raw material input unit, a longitudinal beam forming unit, a longitudinal beam traction unit, a cross beam forming unit and a truss support unit. The raw material input unit stores pre-impregnated wires and pre-impregnated tapes, and a motor drives rollers to convey the pre-impregnated wires and the pre-impregnated tapes forward; the longitudinal beam forming unit is composed of three sets of forming molds, and the pre-impregnated tapes form V-shaped longitudinal beams through heating molds; a stepper motor used in the longitudinal beam traction unit drives three sets of roller traction devices through steering gears to pull formed longitudinal beams; the cross beam forming unit is composed of a motion module and a printing module, and a truss cross beam is printed through a 3D printing method of molten deposition.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: February 27, 2024
    Assignee: NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS
    Inventors: Zhongde Shan, Congze Fan, Jinghua Zheng, Wenzhe Song, Yiwei Chen, Kai Liu