Abstract: An amphibious robot includes a housing including a first shell and a second shell and having a first configuration and a second configuration, a rack disposed in an inner cavity of the housing, a telescopic assembly disposed on the rack and connected between the first shell and the second shell, and a rotary wing assembly disposed on the rack and having a folded configuration and a flight configuration. The rotary wing assembly includes: a folding arm with one end rotatably connected to the rack, a rotary wing, and a tilting arm connected between the rotary wing and the folding arm, the tilting arm and the rotary wing are extended to an outside of the housing to be adapted to drive the robot to fly in the flight configuration, and the tilting arm is rotatable relative to the folding arm to adjust a rotation direction of the rotary wing.

Abstract: A working mode switching method and apparatus, a storage medium, and an electronic device are disclosed. The electronic device comprises a display screen, a first acousto-electric conversion module, and a second acousto-electric conversion module. The first acousto-electric conversion module and the second acousto-electric conversion module are located on one side of the display screen and connected to the display screen; and the first acousto-electric conversion module and the second acousto-electric conversion module are used for realizing the conversion between ultrasonic or acoustic signals and electrical signals.

Abstract: The disclosure provides a display screen and an electronic device. A backlight module has a second notch, a frame includes a receiving space, a backlight element is received in the receiving space, the frame is connect to a display panel, a first adhesive layer covers the connection of the frame and the display panel, a supporting member is disposed between a side wall surrounded the second notch and the backlight element, a second adhesive layer is formed between the frame, the supporting member and a lower surface of the display panel, a cover plate covers the display panel.

Abstract: Disclosed is an electronic device, comprising a glass case, a functional assembly and a first sealing member, wherein a side of the glass case is provided with a first opening and an accommodation space extending from the first opening to the interior of the glass case; the functional assembly is accommodated in the accommodation space; the functional assembly at least comprises a display module and a circuit connected to the display module; and the first sealing member is arranged at the first opening. Further disclosed is an installation method for an electronic device.

Abstract: The disclosure provides a display screen and an electronic device. A backlight module has a second notch, a frame includes a receiving space, a backlight element is received in the receiving space, the frame is connect to a display panel, a first adhesive layer covers the connection of the frame and the display panel, a supporting member is disposed between a side wall surrounded the second notch and the backlight element, a second adhesive layer is formed between the frame, the supporting member and a lower surface of the display panel, a cover plate covers the display panel.

Abstract: The present disclosure provides an electronic device. The electronic device includes a housing assembly, a battery and a display unit. The housing assembly includes a battery cover, a front cover and two reinforcing features. The two reinforcing features have a circular cross section and being arranged at two sides of the battery, each of the two reinforcing features have at least a part embedded in at least one of the battery cover and the front cover by an injection molded part adjacent to a length or a width side of the battery. Axes of the two reinforcing features are flush with a central axis of the battery. The display unit is embedded in the housing assembly.

Abstract: A chip package apparatus is provided. The chip package apparatus includes a substrate, a chip on the substrate, and a filling layer on the substrate and surrounding a portion of the chip. The filling layer is made of epoxy molding compound (EMC) and the EMC is white. An electronic device with the chip package apparatus and a method for manufacturing the chip package apparatus are provided.

Abstract: A manufacturing method for an electronic device is provided. The method includes: providing an inner shell, the inner shell defining a battery compartment for a battery, and the battery compartment including a bottom surface and a side wall; adhering a first adhesive to the bottom surface of the battery compartment; providing an adhesive film covering the first adhesive, the bottom surface and the side wall of the battery compartment; fixing the battery in the battery compartment by the adhesive film; and coating a second adhesive into spaces between a side surface of the battery and the adhesive film, a bonding force of the adhesive film and a bonding force of the second adhesive each being less than a tensile resistance of a surface of the battery.

Abstract: A battery for an electronic device and an electronic device are provided. The battery includes a body module, a component module, a wrapping layer, a first insulating film, a second insulating film and at least one easy-to-pull adhesive tape. Each easy-to-pull adhesive tape includes an adhesion portion, an adhesive-free region and a hand pulling portion, the adhesion portion is located at one end of the easy-to-pull adhesive tape, the hand pulling portion bypasses the component module and is then overlapped with the first insulating film, the adhesive-free region is located between the adhesion portion and the hand pulling portion, and the adhesive-free region is bonded to the wrapping layer.

Abstract: An input assembly includes a touch panel, a fingerprint identification chip, and a flexible circuit board. The fingerprint identification chip is attached to a lower surface of the touch panel. The flexible circuit board is attached to the fingerprint identification chip. The touch panel and the flexible circuit board are correspondingly disposed on two opposite sides of the fingerprint identification chip.

Abstract: A fingerprint module, a method for fabricating the same, and a mobile terminal having the same are provided. The fingerprint module has a cover plate and a fingerprint chip. The cover plate has an inner surface. The fingerprint chip is heat-pressed on the inner surface by adhesive, such that the adhesive fully contacts the cover plate and the fingerprint chip. The method includes after heating the adhesive which is coated on the inner surface of the cover plate, the fingerprint chip is laminated on the adhesive, such that the adhesive fully contacts the cover plate and the fingerprint chip.

Abstract: A fingerprint sensor and a related terminal are provided. The fingerprint sensor includes a chip assembly and a protection element. The chip assembly includes a circuit board and a sealing element laminated on the circuit board. The protection assembly includes a first protection element. The circuit board is engaged with the first protection element to define a space to receive the sealing element, or the sealing element is engaged with the first protection element to define a space to receive the circuit board.

Abstract: Described are a display screen assembly and an electronic device. The display screen assembly includes: a display module including a display panel and a touch panel arranged on the display panel, the display module includes a first end; a first flexible circuit board arranged at the first end of the display module, the first flexible circuit board is electrically connected to the display panel to drive the display panel to implement a display function; and a second flexible circuit board arranged at the first end of the display module, the second flexible circuit board is electrically connected to the touch panel to drive the touch panel to implement a touch function.

Abstract: The present disclosure provides an electronic device. The electronic device includes a housing assembly, a battery and a display unit. The housing assembly includes a battery cover, a front cover and two reinforcing features. The two reinforcing features have a circular cross section and being arranged at two sides of the battery, each of the two reinforcing features have at least a part embedded in at least one of the battery cover and the front cover by an injection molded part adjacent to a length or a width side of the battery. Axes of the two reinforcing features are flush with a central axis of the battery. The display unit is embedded in the housing assembly.

Abstract: A chip package apparatus is provided. The chip package apparatus includes a substrate, a chip on the substrate, and a filling layer on the substrate and surrounding a portion of the chip. The filling layer is made of epoxy molding compound (EMC) and the EMC is white. An electronic device with the chip package apparatus and a method for manufacturing the chip package apparatus are provided.

Abstract: A fingerprint sensor, a terminal, and a method for manufacturing a fingerprint sensor are provided. The fingerprint sensor includes a chip unit and a first adhesive layer. The chip unit includes a first surface and a second surface opposite to the first surface. The first surface is configured to receive a touch operation. The first adhesive layer is directly or indirectly attached to the second surface in a peelable manner.

Abstract: The present disclosure provides a housing assembly for an electronic device and an electronic device. The housing assembly includes a first housing, a second housing and a reinforcing column. The second housing and the first housing collectively define a receptacle, and at least a part of the reinforcing column is embedded in at least one of the first housing and the second housing. For the housing assembly according to the present disclosure, by embedding the reinforcing column in at least one of the first housing and the second housing, structural strength of the first housing or the second housing can be enhanced, and hence overall structural strength of the housing assembly can be enhanced, thereby improving bending resistance of the housing assembly and facilitating a lightweight and thin design of the electronic device.

Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.

Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. The cover plate defines an assembling region. The fingerprint chip is fixed in the assembling region and has a plurality of pads. The intermediate board is bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate. The fingerprint chip is electrically connected to the intermediate board via the pads. The circuit board is electrically connected to the fingerprint chip via the intermediate board. The pads are connected to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip.

Abstract: A chip package apparatus includes a substrate, a chip on the substrate, and a filling layer on the substrate and surrounding a portion of the chip. The filling layer is made of epoxy molding compound (EMC) and the EMC is white. An electronic device with the chip package apparatus and a method for manufacturing the chip apparatus structure are provided.