Patents by Inventor Wenzhi Ye

Wenzhi Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088069
    Abstract: Disclosed herein are integrated circuit (IC) supports with microstrips, and related embodiments. For example, an IC support may include a plurality of microstrips and a plurality of conductive segments. Individual ones of the conductive segments may be at least partially over at least two microstrips, a dielectric material may be between the plurality of microstrips and the plurality of conductive segments, and the conductive segments are included in a tape.
    Type: Application
    Filed: February 26, 2021
    Publication date: March 14, 2024
    Applicant: Intel Corporation
    Inventors: Wenzhi Wang, Xiaoning Ye, Yunhui Chu, Chunfei Ye, James A. McCall
  • Patent number: D859581
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: September 10, 2019
    Assignees: FUJIAN OSPRING SCIENCE TECHNOLOGY DEVELOPMENT CO., LTD., FUZHOU PINXING SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventor: Wenzhi Ye
  • Patent number: D861128
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: September 24, 2019
    Assignee: FUJIAN OSPRING SCIENCE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventor: Wenzhi Ye