Patents by Inventor Weon-Chul Hong

Weon-Chul Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interconnection layer layout comprising cut-out conductive lines that ensure proper profile of overlying passivation layer
    Patent number: 6486556
    Abstract: A layout structure of the interconnection layers of a semiconductor device includes a plurality of conducting lines extending adjacent one another, and at least one rectangular cut-out formed in a side of each of the conducting lines, wherein a width of gap between adjacent ones of the plurality of conducting lines is increased at each rectangular cut-out. The rectangular cut-out serves to increase the space between adjacent conducting lines so as to secure a proper gap there between upon deposition of a passivation layer.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: November 26, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kweon-Jae Lee, Weon-Chul Hong