Patents by Inventor Weon Jung Choi

Weon Jung Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11318722
    Abstract: The present invention provides a method for manufacturing a polymer film, the method comprising the steps of: drying a polymer precursor to form a precursor film; and curing the precursor film to form a polymer film, wherein the drying is performed such that the content of a solvent remaining in the precursor film after the drying is 30% or less.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: May 3, 2022
    Assignees: SK INNOVATION CO., LTD., SK IE TECHNOLOGY CO., LTD.
    Inventors: Seung-Min Jeon, Weon-Jung Choi, Sang-Yoon Park, Jin-Hyung Park
  • Patent number: 10645805
    Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: May 5, 2020
    Assignee: NEXFLEX CO., LTD.
    Inventors: Ho Sub Kim, Byoung Wook Jo, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim, Seung Jeong Kook
  • Publication number: 20180272675
    Abstract: The present invention provides a method for manufacturing a polymer film, the method comprising the steps of: drying a polymer precursor to form a precursor film; and curing the precursor film to form a polymer film, wherein the drying is performed such that the content of a solvent remaining in the precursor film after the drying is 30% or less.
    Type: Application
    Filed: September 23, 2016
    Publication date: September 27, 2018
    Applicant: SK INNOVATION CO., LTD
    Inventors: Seung-Min JEON, Weon-Jung CHOI, Sang-Yoon PARK, Jin-Hyung PARK
  • Publication number: 20160176161
    Abstract: Provided is a flexible metal-clad laminate, comprising; a first metal layer; a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less which is formed on the first metal layer and plasma-treated; a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less which is formed on the first polyimide layer.
    Type: Application
    Filed: February 29, 2016
    Publication date: June 23, 2016
    Inventors: BYOUNG WOOK JO, HO SUB KIM, YOUNG DO KIM, WEON JUNG CHOI, DAE NYOUN KIM
  • Patent number: 9296015
    Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: March 29, 2016
    Assignee: SK INNOVATION CO., LTD.
    Inventors: Byoung Wook Jo, Ho Sub Kim, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim
  • Patent number: 9232660
    Abstract: A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: January 5, 2016
    Assignee: SK Innovation Co., Ltd.
    Inventors: Ho Sub Kim, Yong Seok Lee, Weon Jung Choi, Dae Nyoun Kim, Young Do Kim
  • Publication number: 20150373843
    Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.
    Type: Application
    Filed: December 19, 2013
    Publication date: December 24, 2015
    Inventors: Ho Sub KIM, Byoung Wook JO, Young Do KIM, Weon Jung CHOI, Dae Nyoun KIM, Seung Jeong KOOK
  • Publication number: 20140342137
    Abstract: A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards.
    Type: Application
    Filed: December 27, 2012
    Publication date: November 20, 2014
    Inventors: Ho Sub Kim, Yong Seok Lee, Weon Jung Choi, Dae Nyoun Kim, Young Do Kim
  • Publication number: 20120315494
    Abstract: There is provided a polyamic acid resin composition, a method for preparing the same and a polyimide metal clad laminate using the same, in which the polyamic acid resin composition includes an epoxy compound represented by Chemical Formula 1 is defined in specification.
    Type: Application
    Filed: December 21, 2010
    Publication date: December 13, 2012
    Applicant: SK INNOVATION CO., LTD.
    Inventors: Weon Jung Choi, Dae Nyoun Kim, Seung Hoon Jung, Byoung Wook Jo, Cheol Ho Kim
  • Publication number: 20120156476
    Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 21, 2012
    Applicant: SK INNOVATION CO., LTD.
    Inventors: Byoung Wook JO, Ho Sub KIM, Young Do KIM, Weon Jung CHOI, Dae Nyoun KIM
  • Patent number: 7615289
    Abstract: Disclosed herein is an organic electroluminescent polymer having 9,9-di(fluorenyl)-2,7-fluorenyl unit and an electroluminescent device using the same. Specifically, the current invention provides an organic electroluminescent polymer having 9,9-di(fluorenyl)-2,7-fluorenyl unit, which can be used as a blue electroluminescent polymer and host material by introducing the substituted fluorenyl group at the 9-position of fluorene, and an electroluminescent device using the electroluminescent polymer. The electroluminescent polymer is applicable as a host material for highly pure blue, green and red, having high solubility, high heat stability and high quantum efficiency.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: November 10, 2009
    Assignee: SK Energy Co., Ltd.
    Inventors: Hong You, Weon Jung Choi, Dong Cheol Shin, Sang Soo Lee, Jae Kyu Jin, Jong Wook Kim, Soon Ki Kwon, Yun Hi Kim
  • Patent number: 6156401
    Abstract: Disclosed are an oxygen barrier resin composition and products containing the resin. The resin composition comprises 20 to 80 wt % of an ethylene-vinyl alcohol copolymer, 5 to 79 wt % of an ethylene copolymer, and 1 to 30 wt % of a compatibilizer obtained between a random copolymer of ethylene-maleic anhydride-alkyl(meth)acrylate and a polyamide oligomer ranging, in molecular weight, from 1,000 to 5,000. The compatibilizer functions in such a way that the main chain of the polyamide penetrates into the ethylene-vinyl alcohol phase while the main chain of the ethylene-alkyl(meth)acrylate exists in the ethylene copolymer phase. The resin composition is superior in both melt-moldability and compatibility, providing films, sheets or bottles with superb appearance (transparency), mechanical strength and oxygen barrier.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: December 5, 2000
    Assignee: SK Corporation
    Inventors: Weon-Jung Choi, Oh-Bin Kwon, Kwang-Sik Jung