Patents by Inventor Weon Jung Choi
Weon Jung Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11318722Abstract: The present invention provides a method for manufacturing a polymer film, the method comprising the steps of: drying a polymer precursor to form a precursor film; and curing the precursor film to form a polymer film, wherein the drying is performed such that the content of a solvent remaining in the precursor film after the drying is 30% or less.Type: GrantFiled: September 23, 2016Date of Patent: May 3, 2022Assignees: SK INNOVATION CO., LTD., SK IE TECHNOLOGY CO., LTD.Inventors: Seung-Min Jeon, Weon-Jung Choi, Sang-Yoon Park, Jin-Hyung Park
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Patent number: 10645805Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.Type: GrantFiled: December 19, 2013Date of Patent: May 5, 2020Assignee: NEXFLEX CO., LTD.Inventors: Ho Sub Kim, Byoung Wook Jo, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim, Seung Jeong Kook
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Publication number: 20180272675Abstract: The present invention provides a method for manufacturing a polymer film, the method comprising the steps of: drying a polymer precursor to form a precursor film; and curing the precursor film to form a polymer film, wherein the drying is performed such that the content of a solvent remaining in the precursor film after the drying is 30% or less.Type: ApplicationFiled: September 23, 2016Publication date: September 27, 2018Applicant: SK INNOVATION CO., LTDInventors: Seung-Min JEON, Weon-Jung CHOI, Sang-Yoon PARK, Jin-Hyung PARK
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Publication number: 20160176161Abstract: Provided is a flexible metal-clad laminate, comprising; a first metal layer; a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less which is formed on the first metal layer and plasma-treated; a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less which is formed on the first polyimide layer.Type: ApplicationFiled: February 29, 2016Publication date: June 23, 2016Inventors: BYOUNG WOOK JO, HO SUB KIM, YOUNG DO KIM, WEON JUNG CHOI, DAE NYOUN KIM
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Patent number: 9296015Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.Type: GrantFiled: December 16, 2011Date of Patent: March 29, 2016Assignee: SK INNOVATION CO., LTD.Inventors: Byoung Wook Jo, Ho Sub Kim, Young Do Kim, Weon Jung Choi, Dae Nyoun Kim
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Patent number: 9232660Abstract: A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards.Type: GrantFiled: December 27, 2012Date of Patent: January 5, 2016Assignee: SK Innovation Co., Ltd.Inventors: Ho Sub Kim, Yong Seok Lee, Weon Jung Choi, Dae Nyoun Kim, Young Do Kim
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Publication number: 20150373843Abstract: Provided are a multi-layer flexible metal-clad laminate, and a manufacturing method thereof, and more particularly, a multi-layer flexible metal-clad laminate in which at the time of manufacturing a multi-layer polyimide film on a surface of a metal-clad having a predetermined surface roughness value (Rz, Ra) and having roughening particles having a predetermined size or less attached thereon, a multi-coating scheme is used to form each polyimide mixed layer, such that a light reflection on a surface of the polyimide film and a light reflection generated at an interlayer interface of the polyimide in the multi-layer polyimide film are decreased to have an improved light transmittance of a polyimide laminate film after the metal-clad is removed, and a manufacturing method thereof.Type: ApplicationFiled: December 19, 2013Publication date: December 24, 2015Inventors: Ho Sub KIM, Byoung Wook JO, Young Do KIM, Weon Jung CHOI, Dae Nyoun KIM, Seung Jeong KOOK
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Publication number: 20140342137Abstract: A flexible metal clad laminate includes a metal foil, and a multilayered polyimide film including a first polyimide layer having a glass transition temperature of 300° C. or less and disposed on the metal foil, a second polyimide layer disposed on the first polyimide layer and a third polyimide layer disposed on the second polyimide layer. According to the flexible metal clad laminate of the present invention, appearance defects such as blistering generated during curing process in a continuous curing machine using an infrared heat source may be solved, interlayer delamination may be prevented due to a good adhesion strength with a metal layer, and an ACF bonding strength and a dimensional stability may be good. The flexible metal clad laminate may be useful for the manufacturing of a flexible printed circuit boards.Type: ApplicationFiled: December 27, 2012Publication date: November 20, 2014Inventors: Ho Sub Kim, Yong Seok Lee, Weon Jung Choi, Dae Nyoun Kim, Young Do Kim
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Publication number: 20120315494Abstract: There is provided a polyamic acid resin composition, a method for preparing the same and a polyimide metal clad laminate using the same, in which the polyamic acid resin composition includes an epoxy compound represented by Chemical Formula 1 is defined in specification.Type: ApplicationFiled: December 21, 2010Publication date: December 13, 2012Applicant: SK INNOVATION CO., LTD.Inventors: Weon Jung Choi, Dae Nyoun Kim, Seung Hoon Jung, Byoung Wook Jo, Cheol Ho Kim
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Publication number: 20120156476Abstract: Provided is a method for manufacturing a flexible metal-clad laminate using a casting method, including: (a) forming a first polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or less above a metal layer; (b) plasma-treating a surface of the first polyimide layer; and (c) forming a second polyimide layer having a coefficient of linear thermal expansion of 25 ppm/K or lower above the first polyimide layer. The flexible metal-clad laminate according to the present invention can have excellent adhesion between the polymer film and the metal conductive layer, a low dimensional change, and a low production cost, because of superior casting workability, even though the thickness of polyimide becomes increased.Type: ApplicationFiled: December 16, 2011Publication date: June 21, 2012Applicant: SK INNOVATION CO., LTD.Inventors: Byoung Wook JO, Ho Sub KIM, Young Do KIM, Weon Jung CHOI, Dae Nyoun KIM
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Patent number: 7615289Abstract: Disclosed herein is an organic electroluminescent polymer having 9,9-di(fluorenyl)-2,7-fluorenyl unit and an electroluminescent device using the same. Specifically, the current invention provides an organic electroluminescent polymer having 9,9-di(fluorenyl)-2,7-fluorenyl unit, which can be used as a blue electroluminescent polymer and host material by introducing the substituted fluorenyl group at the 9-position of fluorene, and an electroluminescent device using the electroluminescent polymer. The electroluminescent polymer is applicable as a host material for highly pure blue, green and red, having high solubility, high heat stability and high quantum efficiency.Type: GrantFiled: January 28, 2005Date of Patent: November 10, 2009Assignee: SK Energy Co., Ltd.Inventors: Hong You, Weon Jung Choi, Dong Cheol Shin, Sang Soo Lee, Jae Kyu Jin, Jong Wook Kim, Soon Ki Kwon, Yun Hi Kim
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Patent number: 6156401Abstract: Disclosed are an oxygen barrier resin composition and products containing the resin. The resin composition comprises 20 to 80 wt % of an ethylene-vinyl alcohol copolymer, 5 to 79 wt % of an ethylene copolymer, and 1 to 30 wt % of a compatibilizer obtained between a random copolymer of ethylene-maleic anhydride-alkyl(meth)acrylate and a polyamide oligomer ranging, in molecular weight, from 1,000 to 5,000. The compatibilizer functions in such a way that the main chain of the polyamide penetrates into the ethylene-vinyl alcohol phase while the main chain of the ethylene-alkyl(meth)acrylate exists in the ethylene copolymer phase. The resin composition is superior in both melt-moldability and compatibility, providing films, sheets or bottles with superb appearance (transparency), mechanical strength and oxygen barrier.Type: GrantFiled: September 13, 1999Date of Patent: December 5, 2000Assignee: SK CorporationInventors: Weon-Jung Choi, Oh-Bin Kwon, Kwang-Sik Jung