Abstract: A tester for a mixed signal semiconductor device having a reconstructed digital tester, and a method of testing a semiconductor device using the same are provided. A digital tester electrically tests a digital device and is controlled by a first controller. A metrology instrument module comprising an analog source generator for applying an analog signal to a semiconductor device, an analog waveform digitizer for analyzing the analog signal into a digital signal, and a personal computer including a second controller forms a part of the digital tester, and the first controller is connected to the metrology instrument module through an interface line.

Abstract: A test board is provided to reduce the test time for integrated circuits required by the necessity to stabilize bias voltages applied to IC devices. The test board includes a capacitor connected to specific input terminals of the IC device and a capacitor charging circuit connected between the input terminals of the IC device and the capacitor charging circuit via switches. A testing method using this circuit includes the steps of mounting a test board to a tester, placing the IC device onto the test board, charging the capacitor by driving the capacitor charging circuit, and testing the IC devices according to test items. The test board used in this method includes application circuits for applying bias voltages to the IC device, a capacitor connected between the IC device and a ground terminal, and a capacitor charging circuit for charging the capacitor.

Abstract: A test method for testing an integrated circuit (IC) device, including a step of checking the handler contacts with IC devices to be tested after a test apparatus and a handler are completely set up and before actual testing operations commence. The handler contact check device includes a handler contact check board mounted to the handler, which is provided with a plurality of pins directly contacting outer terminals of the IC devices, and wiring circuits for transferring contact check electrical signals from a test apparatus to the contacts between the plurality of pins and the outer terminals, and for transferring output electrical signals from the contacts to the test apparatus, and a contact check package device having the same shape and outer terminals as the IC devices to be tested.