Patents by Inventor Weon Mook Lee

Weon Mook Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Endpoint detection device for realizing real-time control of plasma reactor, plasma reactor with endpoint detection device, and endpoint detection method
    Patent number: 8223329
    Abstract: An endpoint detection device, a plasma reactor with the endpoint detection device, and an endpoint detection method are provided. The endpoint detection device includes an OES data operation unit, a data selector, a product generator, an SVM, and an endpoint determiner. The OES data operation unit processes reference OES data by normalization and PCA. The data selector selects part of the linear reference loading vectors and selects part of the selected linear reference loading vectors. The product generator outputs at least one reference product value. The SVM performs regression and outputs a prediction product value. The endpoint determiner detects a process wafer etch or deposition endpoint and outputs a detection signal.
    Type: Grant
    Filed: October 24, 2011
    Date of Patent: July 17, 2012
    Assignee: DMS Co. Ltd
    Inventors: Kun Joo Park, Kwang Hoon Han, Kee Hyun Kim, Weon Mook Lee, Kyounghoon Han, Heeyeop Chae
  • ENDPOINT DETECTION DEVICE FOR REALIZING REAL-TIME CONTROL OF PLASMA REACTOR, PLASMA REACTOR WITH ENDPOINT DETECTION DEVICE, AND ENDPOINT DETECTION METHOD
    Publication number: 20120041584
    Abstract: An endpoint detection device, a plasma reactor with the endpoint detection device, and an endpoint detection method are provided. The endpoint detection device includes an OES data operation unit, a data selector, a product generator, an SVM, and an endpoint determiner. The OES data operation unit processes reference OES data by normalization and PCA. The data selector selects part of the linear reference loading vectors and selects part of the selected linear reference loading vectors. The product generator outputs at least one reference product value. The SVM performs regression and outputs a prediction product value. The endpoint determiner detects a process wafer etch or deposition endpoint and outputs a detection signal.
    Type: Application
    Filed: October 24, 2011
    Publication date: February 16, 2012
    Applicant: DMS CO. LTD.
    Inventors: Kun Joo PARK, Kwang Hoon HAN, Kee Hyun KIM, Weon Mook LEE, Kyounghoon HAN, Heeyeop CHAE
  • Endpoint detection device for realizing real-time control of plasma reactor, plasma reactor with endpoint detection device, and endpoint detection method
    Patent number: 8049872
    Abstract: An endpoint detection device, a plasma reactor with the endpoint detection device, and an endpoint detection method are provided. The endpoint detection device includes an OES data operation unit, a data selector, a product generator, an SVM, and an endpoint determiner. The OES data operation unit processes reference OES data by normalization and PCA. The data selector selects part of the linear reference loading vectors and selects part of the selected linear reference loading vectors. The product generator outputs at least one reference product value. The SVM performs regression and outputs a prediction product value. The endpoint determiner detects a process wafer etch or deposition endpoint and outputs a detection signal.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: November 1, 2011
    Assignee: DMS Co., Ltd.
    Inventors: Kun Joo Park, Kwang Hoon Han, Kee Hyun Kim, Weon Mook Lee, Kyounghoon Han, Heeyeop Chae
  • Endpoint Detection Device For Realizing Real-Time Control Of Plasma Reactor, Plasma Reactor With Endpoint Detection Device, And Endpoint Detection Method
    Publication number: 20090029489
    Abstract: An endpoint detection device, a plasma reactor with the endpoint detection device, and an endpoint detection method are provided. The endpoint detection device includes an OES data operation unit, a data selector, a product generator, an SVM, and an endpoint determiner. The OES data operation unit processes reference OES data by normalization and PCA. The data selector selects part of the linear reference loading vectors and selects part of the selected linear reference loading vectors. The product generator outputs at least one reference product value. The SVM performs regression and outputs a prediction product value. The endpoint determiner detects a process wafer etch or deposition endpoint and outputs a detection signal.
    Type: Application
    Filed: February 25, 2008
    Publication date: January 29, 2009
    Applicant: DMS. CO. LTD.
    Inventors: Kun Joo Park, Kwang Hoon Han, Kee Hyun Kim, Weon Mook Lee, Kyounghoon Han, Heeyeop Chae
  • ETCHING GAS CONTROL SYSTEM
    Publication number: 20080271762
    Abstract: An etching gas control system is provided. The system includes a gas injector, a gas supply pipe, a Flow Ratio Controller (FRC), and a gas supply unit. The gas injector is installed in a chamber and supplies gas inside the chamber. The gas injector includes a top injector installed at a top of the chamber and a side injector installed at a side of the chamber. The gas supply pipe connects and supplies gas to the gas injector. The FRC connects to the gas supply pipe and controls supply of gas. The gas supply unit supplies gas to the FRC.
    Type: Application
    Filed: April 2, 2008
    Publication date: November 6, 2008
    Applicant: DMS CO., LTD.
    Inventors: Kun Joo PARK, Hwan Kook CHAE, Byoungil LEE, Kee Hyun KIM, Weon Mook LEE