Patents by Inventor Werner Bück

Werner Bück has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoelectric device having circuitry with structural rigidity
    Patent number: 11075331
    Abstract: A thermoelectric device includes a thermally conductive first plate and at least one thermoelectric sub-assembly. The first plate has a layer with a plurality of electrically conductive first portions and a plurality of electrically insulating second portions separating the first portions from one another. The at least one thermoelectric sub-assembly includes a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. The plurality of thermoelectric elements is in electrical communication with the plurality of electrically conductive portions of the first plate, in electrical communication with electrically conductive portions of the second plate, and in thermal communication with the first plate and the second plate. The plurality of electrically insulating second portions includes a plurality of segments at least partially outside the region, the segments configured to avoid degradation of a structural rigidity of the first plate.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: July 27, 2021
    Assignee: GENTHERM INCORPORATED
    Inventor: Werner Bück
  • THERMOELECTRIC DEVICE HAVING CIRCUITRY WITH STRUCTURAL RIGIDITY
    Publication number: 20200035899
    Abstract: A thermoelectric device includes a thermally conductive first plate and at least one thermoelectric sub-assembly. The first plate has a layer with a plurality of electrically conductive first portions and a plurality of electrically insulating second portions separating the first portions from one another. The at least one thermoelectric sub-assembly includes a thermally conductive second plate and a plurality of thermoelectric elements in a region between the first plate and the second plate. The plurality of thermoelectric elements is in electrical communication with the plurality of electrically conductive portions of the first plate, in electrical communication with electrically conductive portions of the second plate, and in thermal communication with the first plate and the second plate. The plurality of electrically insulating second portions includes a plurality of segments at least partially outside the region, the segments configured to avoid degradation of a structural rigidity of the first plate.
    Type: Application
    Filed: April 5, 2019
    Publication date: January 30, 2020
    Inventor: Werner Bück