Abstract: An arrangement is provided for contacting an integrated circuit in a package by a contact plate arranged on a circuit carrier, wherein the package has contact locations on the contact plate side. In this context, the contact plate has contact vanes, which are formed such that they have a spring action directed normal to the circuit carrier and such that the contact vanes can be brought parallel to the circuit carrier by pressing the package against the contact vanes. The contact locations and contact vanes each establish an electrical connection with one another in the state in which they are pressed against the circuit carrier.

Abstract: An ESD protection structure for an electronic circuit arrangement, in particular for a HF power amplifier is provided. In the ESD protection structure, at least two semiconductor diodes are connected anti-serial to one another. Further, the pn junctions of the two semiconductor diodes possess a common zone of semiconductor material of a certain conductivity type. Thus, an ESD protection structure is provided that can be used even at relatively high frequencies, which offers a reliable protective effect in the event of overvoltages with improved modulation capability in the HF range without resulting in signal distortion during operation.

Abstract: An arrangement is provided for contacting an integrated circuit in a package by a contact plate arranged on a circuit carrier, wherein the package has contact locations on the contact plate side. In this context, the contact plate has contact vanes, which are formed such that they have a spring action directed normal to the circuit carrier and such that the contact vanes can be brought parallel to the circuit carrier by pressing the package against the contact vanes. The contact locations and contact vanes each establish an electrical connection with one another in the state in which they are pressed against the circuit carrier.

Abstract: A microwave line structure which has a first conducting track applied onto a substrate and a second conducting track which extends, supported on posts, at a distance above the first conducting track, a coplanar line being arranged, in addition to the microstrip line formed by the first conducting track and the second conducting track, on the substrate and coupled to this microstrip line, and the microstrip line extending between the two conducting tracks of the coplanar line, wherein, at one end of the coplanar line, the two conducting tracks of the latter are electrically conductingly connected to one another and to the first conducting track, wherein at the other end of the coplanar line the latter is open, wherein the length of the coplanar line is approximately equal to one quarter of the wavelength of the average operating frequency and wherein an asymmetrical line can be coupled to the first conducting track and the second conducting track at the short-circuited end of the coplanar line and a symmetrica