Patents by Inventor Werner Blaha

Werner Blaha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer, apparatus and process for producing the semiconductor wafer
    Patent number: 7867059
    Abstract: The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.
    Type: Grant
    Filed: November 16, 2007
    Date of Patent: January 11, 2011
    Assignee: Siltronic AG
    Inventors: Georg Pietsch, Michael Kerstan, Werner Blaha
  • Semiconductor Wafer, Apparatus and Process For Producing The Semiconductor Wafer
    Publication number: 20090203297
    Abstract: The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.
    Type: Application
    Filed: November 16, 2007
    Publication date: August 13, 2009
    Applicant: SILTRONIC AG
    Inventors: Georg Pietsch, Michael Kerstan, Werner Blaha
  • Semiconductor wafer, apparatus and process for producing the semiconductor wafer
    Publication number: 20050173377
    Abstract: The invention relates to a process for producing a semiconductor wafer by double-side grinding of the semiconductor wafer, in which the semiconductor wafer is simultaneously ground on both sides, first by rough-grinding and then by finish-grinding, using a grinding tool. The semiconductor wafer, between the rough-grinding and the finish-grinding, remains positioned in the grinding machine, and the grinding tool continues to apply a substantially constant load during the transition from rough-grinding to finish-grinding. The invention also relates to an apparatus for carrying out the process and to a semiconductor wafer having a local flatness value on a front surface of less than 16 nm in a measurement window of 2 mm×2 mm area and of less than 40 nm in a measurement window of 10 mm×10 mm area.
    Type: Application
    Filed: February 4, 2005
    Publication date: August 11, 2005
    Inventors: Georg Pietsch, Michael Kerstan, Werner Blaha