Patents by Inventor Werner Blum

Werner Blum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220396968
    Abstract: The invention relates to an adapter element for fastening a planar element, in particular an awning, to a vehicle, including an adapter body, which has a first edge region for fastening the adapter element to a vehicle, and a second edge region for fastening a planar element to the adapter element. The first edge region of the adapter body is equipped with a vehicle connection element for releasably fastening the first edge region to a vehicle. The second edge region of the adapter body is equipped at the second edge region with a planar element connection element for releasably fastening the second edge region to an edge region of a planar element. The invention also relates to a modular system having such an adapter element and having a planar element.
    Type: Application
    Filed: November 7, 2019
    Publication date: December 15, 2022
    Inventors: Marko Zemke, Werner Blum
  • Patent number: 10354826
    Abstract: To produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: July 16, 2019
    Assignee: Vishay BCcomponents Beyschlag GmbH
    Inventors: Werner Blum, Reiner Friedrich, Wolfgang Werner, Reimer Hinrichs
  • Publication number: 20160372293
    Abstract: To produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.
    Type: Application
    Filed: June 13, 2016
    Publication date: December 22, 2016
    Applicant: VISHAY BCcomponents BEYSCHLAG GmbH
    Inventors: Werner Blum, Reiner Friedrich, Wolfgang Werner, Reimer Hinrichs
  • Patent number: 9368308
    Abstract: In order to produce a cost-effective fuse in chip design, which is applied to a carrier substrate made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor and a cover layer, in which the melting point of the metallic conductor may be defined reliably, it is suggested that an intermediate layer having low thermal conductivity be positioned between the carrier substrate and the metallic conductor, the intermediate layer being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer applied in island printing. Furthermore, a method for manufacturing the fuse is specified.
    Type: Grant
    Filed: June 27, 2005
    Date of Patent: June 14, 2016
    Assignee: VISHAY BCcomponents BEYSCHLAG GmbH
    Inventors: Werner Blum, Reiner Friedrich, Reimer Hinrichs, Wolfgang Werner
  • Publication number: 20080303626
    Abstract: In order to produce a cost-effective fuse (100) in chip design, which is applied to a carrier substrate (10) made of a Al2O3 ceramic having a high thermal conductivity, and which is provided with a fusible metallic conductor (13) and a cover layer (14), in which the melting point of the metallic conductor (13) may be defined reliably, it is suggested that an intermediate layer (11) having low thermal conductivity be positioned between the carrier substrate (10) and the metallic conductor (13), the intermediate layer (11) being formed by a low-melting-point inorganic glass paste applied in the screen-printing method or an organic intermediate layer (11) applied in island printing. Furthermore, a method for manufacturing the fuse (100) is specified.
    Type: Application
    Filed: June 27, 2005
    Publication date: December 11, 2008
    Applicant: VISHAY BCcomponents BEYSCHLAG GmbH
    Inventors: Werner Blum, Reiner Friedrich, Reimer Hinrichs, Wolfgang Werner
  • Publication number: 20040175493
    Abstract: A process for producing an adhesive tape with a stripe-shaped application of the adhesive on a backing material, where the backing web is guided past a dip roll which is in contact with the backing web, the roll rotates in a bath of adhesive, thereby transferring the adhesive to the roll surface, the roll is designed such that after the roll has run through the bath at least one stripe on the roll surface is adhesive-free.
    Type: Application
    Filed: July 28, 2003
    Publication date: September 9, 2004
    Applicant: Tesa
    Inventors: Thomas Monschein, Johannes Kiefer, Michael Rossler, Werner Blum