Abstract: An apparatus and method are provided to treat for example a semiconductor wafer substrate wherein a delivery means for heat, a cryogen, and a fluid chemical reactant, is disposed in a chamber in which the substrate is disposed for at least one surface of the substrate to be cleaned in the chamber. The chamber may also consist of a plurality of stations for chemically treating, providing cryogen to the substrate to effect such cleaning and heating. Air is provided in the chamber in a laminar flow substantially parallel to the surface being treated to remove displaced material from the surface and prevent redeposition of the material on the substrate surface.

Abstract: A device for protecting a needle in medical equipment includes a rigid front part connected to a flexible rear part. The front and rear parts surround the needle circumferentially. A locking mechanism is accommodated in a chamber provided in the front part. In a position of preparedness, the locking mechanism allows the needle to pass through a hole or in the front part. In an activated position, it presents the needle from passing through. In the position of preparedness, the parts are spaced from the tip of the needle. The locking mechanism is a resilient member which in the position of preparedness is maintained under tension, exerting a force substantially at right angles to the longitudinal direction of the needle, so that the tip of the needle, in the position of preparedness, is supported by the hole or the channel.