Abstract: The proposal relates to a device for protecting an electrical and/or electronic component, arranged on a carrier substrate, from electrostatic discharges, an overvoltage occurring in the case of discharge at a carrier-substrate contact element connected to the component being diverted to a ground connection, bypassing the component. It is proposed that the protective device include a first electroconductive structure conductively connected to the jeopardized contact element, and a second electroconductive structure arranged adjacent to the first structure on the carrier substrate and conductively connected to the ground connection.

Abstract: In an arrangement composed of a substrate and a heat sink, the substrate is provided on a first side with at least one power component arranged on a first large-surface printed circuit trace and, on a second side opposite the power component, with a second large-surface printed circuit trace, which is connected in a thermally conductive manner to the first printed circuit trace via via holes. The substrate is mounted at the second side onto the heat sink in a thermally conductive manner, in order to achieve a good heat coupling of the substrate to the heat sink and the same time to avoid an undesirable electrical contact between the potential-carrying printed circuit traces and the heat sink. The substrate having spacer elements arranged on the second side is placed onto the heat sink and to hold it at a defined distance from the heat sink, the gap formed by the distance between the substrate and the heat sink being filled with a thermally conductive filler.