Patents by Inventor Werner Cziep

Werner Cziep has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Producing viaholes in plastic sheets and application of the method
    Patent number: 5022956
    Abstract: Viaholes are dry-etched into glass fiber reinforced plastic sheets according to a predetermined hole pattern, leaving the glass fiber meshing practically unaffected.The method is used, for instance, to fabricate plastic sheets with unilaterally or bilaterally applied conductor patterns and viaconnectors that are conductively linked to the conductor patterns, and to fabricate multilayer board laminates obtained by several plastic sheets carrying the conductor pattern being alternately packaged, if required, with untreated copper sheets, and by the package thus obtained being subsequently laminated. Such boards and/or plastic sheets bilaterally provided with conductor patterns may be used as connector boards for, say, multilayer ceramic modules carrying semiconductor chips.
    Type: Grant
    Filed: June 10, 1985
    Date of Patent: June 11, 1991
    Assignee: International Business Machines Corporation
    Inventors: Werner Cziep, Ulrich Kuenzel, Wolf-Dieter Ruh
  • Producing viaholes in plastic sheets and application of the method
    Patent number: 4834835
    Abstract: Viaholes are dry-etched into glass fiber reinforced plastic sheets according to a predetermined hole pattern, leaving the glass fiber meshing practically unaffected.The method is used, for instance, to fabricate plastic sheets with unilaterally or bilaterally applied conductor patterns and viaconnectors that are conductively linked to the conductor patterns, and to fabricate multilayer board laminates obtained by several plastic sheets carrying the conductor pattern being alternately packaged, if required, with untreated copper sheets, and by the package thus obtained being subsequently laminated. Such boards and/or plastic sheets bilaterally provided with conductor patterns may be used as connector boards for, say, multilayer ceramic modules carrying semiconductor chips.
    Type: Grant
    Filed: August 18, 1987
    Date of Patent: May 30, 1989
    Assignee: International Business Machines Corp.
    Inventors: Werner Cziep, Ulrich Kuenzel, Wolf-Dieter Ruh