Patent number: 5277725
Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
Type:
Grant
Filed:
May 11, 1992
Date of Patent:
January 11, 1994
Assignee:
International Business Machines Corporation
Inventors:
John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey, David R. Clarke, George Czornyj, Allen J. Dam, Lawrence D. David, Renuka S. Divakaruni, Werner E. Dunkel, Ajay P. Giri, Liang-Choo Hsia, James N. Humenik, Steven M. Kandetzke, Daniel P. Kirby, John U. Knickerbocker, Sarah H. Knickerbocker, Anthony Mastreani, Amy T. Matts, Robert W. Nufer, Charles H. Perry, Srinivasa S. N. Reddy, Salvatore J. Scilla, Mark A. Takacs, Lovell B. Wiggins
Patent number: 5135595
Abstract: The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
Type:
Grant
Filed:
March 30, 1990
Date of Patent:
August 4, 1992
Assignee:
International Business Machines Corporation
Inventors:
John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant, Jon A. Casey, David R. Clarke, George Czornyj, Allen J. Dam, Lawrence D. David, Renuka S. Divakaruni, Werner E. Dunkel, Ajay P. Giri, Liang-Choo Hsia, James N. Humenik, Steven M. Kandetzke, Daniel P. Kirby, John U. Knickerbocker, Sarah H. Knickerbocker, Anthony Mastreani, Amy T. Matts, Robert W. Nufer, Charles H. Perry, Srinivasa S. N. Reddy, Salvatore J. Scilla, Mark A. Takacs, Lovell B. Wiggins
