Abstract: An electrically heated soldering device adapted to simultaneously heat a plurality of spaced electrical elements in a reflow soldering operation includes an elongated metal laminate of substantially U-shaped cross section having a bight portion between two side portions which may be parallel or divergent. The laminate includes a layer of aluminum between a layer of copper and a layer of stainless steel, with the layers being roll bonded together. The copper and aluminum layers are removed at the bight portion to expose the stainless steel layer and form a heat generating zone for contacting the plurality spaced electrical elements which is corrosion resistant and nonwettable by solder. The edges of the copper and aluminum layers adjacent to the exposed stainless steel bight portion are shaped to impart a selectable temperature profile, either uniform or non-uniform along the length of the bight portion.

Abstract: In the electrodeposition of metals, the position and shape of the anode with respect to the cathode is critical for uniform deposition of the metal on the cathode. A bipolar electrode comprising a pair of electrically interconnected porous electrodes having surfaces of the metal to be deposited is interposed between the anode and the cathode. The bipolar porous electrode facing the cathode provides metal ions for deposition on the cathode and the bipolar porous electrode facing the anode is plated with metal ions formed at the anode. The position of the bipolar electrode may be periodically reversed, and uniform deposition on the cathode is obtained independent of the shape, size, and position of the anode.