Abstract: Thermal Cut-Off (TCO) devices suitable for surface mount reflow processes are disclosed. The TCO devices are modeled after existing lead attached TCO device structures, but are improved with compact and miniaturized structures suitable for surface mount reflow operations. The arm and base terminals include pads for surface mount reflow. The base molds are designed for receiving the PTC device, bimetal device, and arm terminal feature and may operate using either a single base terminal or a multi-part base terminal. Multiple cover designs are disclosed to lower the heat capacity of the upper plate of the TCO device relative to the base terminal. A TCO device featuring an integrated arm and bimetal device terminal is also disclosed, with an updated base portion to support the integrated terminal.

Abstract: Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a fuse assembly having a fusible link extending between a first lead end and a second lead end, and a first lead extending from the first lead end and a second lead extending from the second lead end. The protection device may further include a body including a first section coupleable with a second section, wherein the first and second sections define a central cavity housing the fusible link. The first section may include an interior face operable to engage an opposite interior face of the second section, an engagement member extending away from the interior face towards the second section, and an engagement channel adjacent the engagement member, the engagement channel operable to receive a corresponding engagement member of the second section.

Abstract: A thermal protection device, comprising: a first PTC device, arranged in a PTC circuit, and having a first input side, coupled to an input path of the PTC circuit, and having a first output side, coupled to an output path of the PTC circuit; a second PTC device, arranged in the PTC circuit, and having a second input side, coupled to the input path of the PTC circuit, and having a second output side, coupled to the output path of the PTC circuit; and a thermal link having a third input side, coupled to the first output side of the first PTC device and the second output side of the second PTC device, via the output path of the PTC circuit.

Abstract: Disclosed are various pallet assemblies for arc spray applications. In some embodiments, an assembly may include a top frame comprising a plurality of recesses each operable to receive an electronic device, and a bottom frame coupled to the top frame, wherein the bottom frame comprises a plurality of support structures, and wherein each support structure of the plurality of support structures is aligned with a corresponding recess of the plurality of recesses. The assembly may further include a mechanical device coupled to the top frame and the bottom frame, wherein the mechanical device is operable to bias the top frame and the bottom frame relative to one another.

Abstract: A spray coating protection method for electronic devices during metallic particle deposition via spraying is disclosed. The spray coating protection method enables selectivity over the size and location of particle deposition. The spray coating protection method is easy for an automation application, in which multiple electronic devices are processed simultaneously, and is suitable for electronic devices of different shapes and sizes. The spray coating protection method provides resistance to high temperature and high pressure during the spraying operation. The spray coating protection method utilizes masking paper, but additional film materials may be used, both to increase the protective strength of the mask and to enable easy placement and subsequent peel off of the masking paper following the spraying process. The masking paper may be made using a die cutting process and is easily placed onto the electronic device surface to ensure zero contamination from hot and high pressure spray particles.

Abstract: A metal oxide varistor (MOV) device including a MOV chip having first and second electrodes disposed on opposing side thereof, a first lead frame portion including a first contact tab electrically connected to the first electrode and a first lead contiguous with the first contact tab and extending away from the MOV chip, a second lead frame portion including a second contact tab electrically connected to the second electrode and a second lead contiguous with the second contact tab and extending away from the MOV chip, and a device body encasing the MOV chip, the first contact tab, the second contact tab, and portions of the first and second leads, wherein the first and second leads extend out of the device body and are bent into flat abutment with a bottom surface of the device body.

Abstract: Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a fuse assembly having a fusible link extending between a first lead end and a second lead end, and a first lead extending from the first lead end and a second lead extending from the second lead end. The protection device may further include a body including a first section coupleable with a second section, wherein the first and second sections define a central cavity housing the fusible link. The first section may include an interior face operable to engage an opposite interior face of the second section, an engagement member extending away from the interior face towards the second section, and an engagement channel adjacent the engagement member, the engagement channel operable to receive a corresponding engagement member of the second section.

Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.

Abstract: Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a fuse assembly having a fusible link extending between a first lead end and a second lead end, and a first lead extending from the first lead end and a second lead extending from the second lead end. The protection device may further include a body including a first section coupleable with a second section, wherein the first and second sections define a central cavity housing the fusible link. The first section may include an interior face operable to engage an opposite interior face of the second section, an engagement member extending away from the interior face towards the second section, and an engagement channel adjacent the engagement member, the engagement channel operable to receive a corresponding engagement member of the second section.

Abstract: Disclosed are various protection devices and associated methods. In some embodiments, a protection device may include a fuse assembly having a fusible link extending between a first lead end and a second lead end, and a first lead extending from the first lead end and a second lead extending from the second lead end. The protection device may further include a body including a first section coupleable with a second section, wherein the first and second sections define a central cavity housing the fusible link. The first section may include an interior face operable to engage an opposite interior face of the second section, an engagement member extending away from the interior face towards the second section, and an engagement channel adjacent the engagement member, the engagement channel operable to receive a corresponding engagement member of the second section.

Abstract: Embodiments of the disclosure are directed to a harness assembly including a substrate having a plurality of vias, and a trace formed atop the substrate, the trace extending between each of the plurality of vias. The harness assembly may further include a surface mounted device disposed within a via of the plurality of vias.

Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.

Abstract: A method for manufacturing an insulated conductive material, the method including providing a wire, applying a masking material to one or more regions of the wire, coating regions of the wire other than the one or more regions with an insulating material by, electrically charging the wire with a first charge polarity, providing a medium of electrically charged insulating material particles that are charged with an opposite polarity, passing the charged wire through the medium, whereby the insulating material particles bind areas of the conductive material other than the one or more regions, curing the insulating material particles, and applying a solvent to the masking material to thereby remove the masking material, wherein the cured insulated material particles are substantially unaffected by the solvent.

Abstract: A protection device may include a resistor, the resistor including a first end for coupling between a load and a second end for coupling to a DC source. The protection device may also include a capacitor having a first terminal coupled between the second end of the resistor and the DC source, and a second terminal coupled to ground, the capacitor further comprising a capacitor body, wherein the capacitor body comprises a ferroelectric material.

Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.

Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.

Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.

Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.

Abstract: An electromagnetic interference (EMI) circuit assembly includes a first, second, and third conductive layer. A protection component disposed between the first and second conductive layers. A dielectric layer is disposed between the second and the third conductive layers. The protection component is configured to protect a load from one or both of an overcurrent condition and an over temperature condition, and the third layer define a capacitor configured to suppress EMI signals.

Abstract: A protection device may include a resistor, the resistor including a first end for coupling between a load and a second end for coupling to a DC source. The protection device may also include a capacitor having a first terminal coupled between the second end of the resistor and the DC source, and a second terminal coupled to ground, the capacitor further comprising a capacitor body, wherein the capacitor body comprises a ferroelectric material.