Patents by Inventor Werner K. Robl

Werner K. Robl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level
    Patent number: 6866943
    Abstract: A bond pad structure formed over a predetermined area of an IC substrate comprising quickly and easily removable redundancy and passivation layers upon lithography and plasma etching in a plasma containing Cl2, the bond structure comprises: a liner or lower metal layer formed on a predetermined area of the IC substrate; an aluminum-based metal layer formed on the liner layer as the last metal layer for bond purposes; a tungsten based redundancy layer formed on top of the aluminum-based last metal layer; and a passivation layer formed over the IC substrate and on the tungsten based redundancy layer.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: March 15, 2005
    Assignee: Infineon Technologies AG
    Inventors: Gerald Friese, Werner K. Robl, Hans-Joachim Barth, Axel Brintzinger
  • BOND PAD STRUCTURE COMPRISING TUNGSTEN OR TUNGSTEN COMPOUND LAYER ON TOP OF METALLIZATION LEVEL
    Publication number: 20030203216
    Abstract: A bond pad structure formed over a predetermined area of an IC substrate comprising quickly and easily removable redundancy and passivation layers upon lithography and plasma etching in a plasma containing Cl2, the bond structure comprising:
    Type: Application
    Filed: April 30, 2002
    Publication date: October 30, 2003
    Applicant: Infineon Technologies North America Corp.
    Inventors: Gerald Friese, Werner K. Robl, Hans-Joachim Barth, Axel Brintzinger