Patents by Inventor Werner Koehler

Werner Koehler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module
    Patent number: 5508560
    Abstract: A semiconductor module includes a metal base plate having a plane upper sace and a convex lower surface. An electrically insulating and thermally conductive substrate is material-lockingly connected to the upper surface of the metal base plate. Semiconductor chips are material-lockingly connected to an upper surface of the substrate.
    Type: Grant
    Filed: November 8, 1994
    Date of Patent: April 16, 1996
    Assignee: Eupec Europaeische Gesellschaft Fuer Leistungs-Halbletter mbh & Co. KG
    Inventors: Werner Koehler, Reinhold Spanke