Abstract: Apparatus for handling delicate workpieces such as semiconductor substrates which have the configuration of small plates. The workpieces are preliminarily situated at predetermined locations in a positioning plane. Then, without changing their positions relative to each other, the workpieces are all simultaneously transferred away from the positioning plane while being maintained during transfer in a common plane which moves with the workpieces. During their transfer the workpieces are held by suction in this common plane by way of suitable suction nozzles which have at least at their ends which engage the workpieces a soft elastic material.