Patents by Inventor Werner Maiwald

Werner Maiwald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed wiring board to which solder has been applied
    Patent number: 5315070
    Abstract: A method for applying solder to printed wiring boards includes producing a printed wiring board with electrically conductive regions. Soldering paste is applied as a solder deposit on the electrically conductive regions. The solder deposits are melted to form hump-shaped solid solder applications joined to the printed wiring board. The hump-shaped solder applications are levelled out by areally applying pressure to the solder applications in the direction of the printed wiring board. A printed wiring board to which solder has been applied includes a wiring board surface having regions to be equipped with components according to an SMD process. Solder applications are disposed on the regions in the form of a solid solder layer. The solid solder layer has a pressed or rolled surface extended substantially parallel to the wiring board surface.
    Type: Grant
    Filed: June 29, 1992
    Date of Patent: May 24, 1994
    Assignee: Siemens Aktiengesellschaft
    Inventor: Werner Maiwald
  • Method for applying solder to and mounting components on printed circuit boards
    Patent number: 5271548
    Abstract: A method for applying solder to and mounting components on printed circuit boards, includes applying a solder paste to electrically conductive regions of a printed circuit board to form solder deposits, and subsequently melting the solder deposits into solder applications joined to the conductive regions. The components are joined to the printed circuit board with an adhesive applied to the printed circuit board between the electrically conductive regions, while assigning each of the electrically conductive regions to a respective one of the components. A flux is applied and a soldering process is performed.
    Type: Grant
    Filed: August 14, 1992
    Date of Patent: December 21, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventor: Werner Maiwald
  • Method for applying solder to printed wiring boards and printed wiring board to which solder has been applied
    Patent number: 5172853
    Abstract: A method for applying solder to printed wiring boards includes producing a printed wiring board with electrically conductive regions. Soldering paste is applied as a solder deposit on the electrically conductive regions. The solder deposits are melted to form hump-shaped solid solder applications joined to the printed wiring board. The hump-shaped solder applications are levelled out by areally applying pressure to the solder applications in the direction of the printed wiring board. A printed wiring board to which solder has been applied includes a wiring board surface having regions to be equipped with components according to an SMD process. Solder applications are disposed on the regions in the form of a solid solder layer. The solid solder layer has a pressed or rolled surface extended substantially parallel to the wiring board surface.
    Type: Grant
    Filed: December 2, 1991
    Date of Patent: December 22, 1992
    Assignee: Siemens Aktiengesellschaft
    Inventor: Werner Maiwald