Patents by Inventor Werner Marchl

Werner Marchl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Configuration of multiple LED module
    Patent number: 8511855
    Abstract: A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: August 20, 2013
    Assignee: OSRAM GmbH
    Inventors: Werner Marchl, Werner Spath, Gunter Waitl
  • Configuration of Multiple LED Module
    Publication number: 20120134154
    Abstract: A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
    Type: Application
    Filed: February 2, 2012
    Publication date: May 31, 2012
    Applicant: Osram AG
    Inventors: Werner MARCHL, Werner SPÄTH, Günter WAITL
  • Configuration of multiple LED module
    Patent number: 8113688
    Abstract: A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: February 14, 2012
    Assignee: Osram AG
    Inventors: Werner Marchl, Werner Spath, Gunter Waitl
  • Configuration of Multiple LED Module
    Publication number: 20110095311
    Abstract: A configuration of multiple LED modules having a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer. The first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
    Type: Application
    Filed: January 4, 2011
    Publication date: April 28, 2011
    Applicant: Osram GmbH
    Inventors: Werner Marchl, Werner Späth, Günter Waitl
  • Configuration of multiple LED modules
    Patent number: 7862211
    Abstract: A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: January 4, 2011
    Assignee: Osram GmbH
    Inventors: Werner Marchl, Werner Späth, Günter Waitl
  • Configuration of multiple LED modules
    Publication number: 20090052178
    Abstract: A configuration of multiple LED modules comprising a plurality of LED modules that each contain a carrier that has a first main area, a second main area and at least one semiconductor layer, wherein the first main area has a planar configuration. The LED modules also include a plurality of LED semiconductor bodies that applied on the first main area of the carrier. In addition, the multiple LED modules include a common heat sink, where the carrier of the LED modules in each case are connected to the common heat sink on the second main area.
    Type: Application
    Filed: October 20, 2008
    Publication date: February 26, 2009
    Inventors: Werner Marchl, Werner Spath, Gunter Waitl
  • LED module
    Patent number: 7439549
    Abstract: An LED module has a carrier, which contains a semiconductor layer and has a planar main area, on which LED semiconductor bodies are applied. Use is preferably made of LED semiconductor bodies which emit light of differing central wavelengths during operation, so that the LED module is suitable for generating mixed-color light, and in particular for generating white light.
    Type: Grant
    Filed: April 16, 2003
    Date of Patent: October 21, 2008
    Assignee: Osram GmbH
    Inventors: Werner Marchl, Werner Späth, Günter Waitl
  • Method for producing a lens mold
    Publication number: 20070290383
    Abstract: A method for producing a lens mold suitable for manufacturing a field of micro-lenses is disclosed. The method includes the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.
    Type: Application
    Filed: August 20, 2007
    Publication date: December 20, 2007
    Inventors: Georg Bogner, Wolfgang Gramann, Patrick Kromotis, Werner Marchl, Werner Spath, Gunter Waitl
  • Radiation source and method for producing a lens mould
    Patent number: 7262437
    Abstract: A radiation source has a field of semiconductor chips, which are disposed below a field of micro-lenses (8) disposed in a hexagonal lattice structure. The radiation source is distinguished by high radiation output and radiation density.
    Type: Grant
    Filed: July 30, 2001
    Date of Patent: August 28, 2007
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Georg Bogner, Wolfgang Gramann, Patrick Kromotis, Werner Marchl, Werner Späth, Günter Waitl
  • Radiation source and method for producing a lens mould
    Publication number: 20040026706
    Abstract: A radiation source has a field of semiconductor chips, which are disposed below a field of micro-lenses (8) disposed in a hexagonal lattice structure. The radiation source is distinguished by high radiation output and radiation density.
    Type: Application
    Filed: July 15, 2003
    Publication date: February 12, 2004
    Inventors: Georg Bogner, Wolfgang Gramann, Patrick Kromotis, Werner Marchl, Werner Spath, Gunter Waitl
  • Led module
    Publication number: 20030178627
    Abstract: An LED module has a carrier, which contains a semiconductor layer and has a planar main area, on which LED semiconductor bodies are applied. Use is preferably made of LED semiconductor bodies which emit light of differing central wavelengths during operation, so that the LED module is suitable for generating mixed-color light, and in particular for generating white light.
    Type: Application
    Filed: April 16, 2003
    Publication date: September 25, 2003
    Inventors: Werner Marchl, Werner Spath, Gunter Waitl