Abstract: A vertical plug-in single-in-line circuit module with a carrier for carrying a row of single-in-line mounted metal pins lying in the plane of the carrier along one carrier edge as outer electrical connections of one or more resistive elements such as a resistance area or resistance path. A first region of the resistive element is located closer to the metal pins of the carrier than a second region of the resistive element. Leads couple the metal pins to the resistive element. The first region lying closest to the metal pins is so constructed that it sees a higher heat dissipation per unit surface area during operation than the second region. The leads are connected to the resistive element such that the current can flow between the first region and second region.

Abstract: A method for electrically bonding tantalum thin film capacitor networks to other networks is described. A first non-conducting support member has a thin film tantalum capacitor mounted thereon. A second non-conducting support member has another component such as a resistor mounted thereon. The two non-conducting support members are placed in a back-to-back position so that the thin film tantalum capacitor and the other component are remote from each other. These two non-conducting support members are then bound together and dipped into a molten solder bath to form a solder coating on the metal elements of the completed network.