Abstract: A surface emitting semiconductor laser chip contains a semiconductor body, which has, at least partly, a crystal structure with principal crystal directions, a radiation exit face, and side faces laterally delimiting the semiconductor body. At least one of the side faces is disposed obliquely with respect to the principal crystal directions.

Abstract: A mold core of an injection molding tool for the injection molding of preforms of plastic material. The mold core is in the form of a hollow casing which is closed at one end, with a central axis, an outer surface, an inner surface and a hollow cooling tube. The hollow tube is arranged in the mold core at a spacing from the inner surface and is in communication with coolant feed conduits and coolant discharge conduits. The cooling tube extends coaxially with respect to the mold core over almost the entire length thereof and is provided at the downstream end with an outlet opening and cooling grooves are provided on the inner surface of the mold core.

Abstract: A light-emitting diode (1) has a lens body (3) that is fabricated from an inorganic solid. Fastened on the lens body (3) are semiconductor chips (2) that emit light beams (18). Furthermore, the light-emitting diode (1) is provided with a housing (20) that can be screwed into a conventional lamp holder via a thread (21).

Abstract: A light-emitting chip (3) has a lens-type coupling-out window (4), whose base area (5) is provided with a mirror area (6). Arranged on a coupling-out area (7) of the coupling-out window (4) is a layer sequence (9), with a photon-emitting pn junction (10). The photons emitted by the pn junction are reflected at the mirror area (6) and can leave the coupling-out window (4) through the coupling-out area (7).

Abstract: A surface emitting semiconductor laser chip contains a semiconductor body, which has, at least partly, a crystal structure with principal crystal directions, a radiation exit face, and side faces laterally delimiting the semiconductor body. At least one of the side faces is disposed obliquely with respect to the principal crystal directions.

Abstract: Proposed for high-performance light-emitting diodes are semiconductor chips (1) whose longitudinal sides are substantially longer than their transverse sides. Light extraction can be substantially improved in this manner.

Abstract: A hot runner manifold system for an injection mould for simultaneous injection moulding of several parts or of large parts, having a multiplicity of injection orifices (24). The orifices are designed for delivering injection moulding compound substantially simultaneously under high pressure and at high temperatures into specified mould zones. The mould zones are provided at least partially on main manifolds (11, 12, 13, 14) that are separated from one another, which main manifolds have hot runners (17, 19, 21, 23) and are connected via at least one pre-manifold (2). The pre-manifold has hot runners (4, 7), and is connected to a sprue (1) for receipt of the injection moulding compound.

Abstract: Proposed for high-performance light-emitting diodes are semiconductor chips (1) whose longitudinal sides are substantially longer than their transverse sides. Light extraction can be substantially improved in this manner.

Abstract: A light-emitting diode (1) has a lens body (3) that is fabricated from an inorganic solid. Fastened on the lens body (3) are semiconductor chips (2) that emit light beams (18). Furthermore, the light-emitting diode (1) is provided with a housing (20) that can be screwed into a conventional lamp holder via a thread (21).

Abstract: A light-emitting chip (3) has a lens-type coupling-out window (4), whose base area (5) is provided with a mirror area (6). Arranged on a coupling-out area (7) of the coupling-out window (4) is a layer sequence (9), with a photon-emitting pn junction (10). The photons emitted by the pn junction are reflected at the mirror area (6) and can leave the coupling-out window (4) through the coupling-out area (7).