Patents by Inventor Werner Pollak

Werner Pollak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8845347
    Abstract: A system including a mounting frame assembly for a head unit for a vehicle. The mounting frame assembly and the head unit may be attached to a vehicle. The mounting frame assembly may include a region operable to house a connector assembly. The connector assembly may include a connector operable to connect to a respective connector of the head unit. With respect to the connectors of the mounting frame assembly and the head unit, either may include an electrical and/or fiber optic connector.
    Type: Grant
    Filed: August 15, 2012
    Date of Patent: September 30, 2014
    Assignee: Harman Becker Automotive Systems GmbH
    Inventors: Alois Karl, Werner Pollak, Dieter Acker
  • Publication number: 20130043774
    Abstract: A system including a mounting frame assembly for a head unit for a vehicle. The mounting frame assembly and the head unit may be attached to a vehicle. The mounting frame assembly may include a region operable to house a connector assembly. The connector assembly may include a connector operable to connect to a respective connector of the head unit. With respect to the connectors of the mounting frame assembly and the head unit, either may include an electrical and/or fiber optic connector.
    Type: Application
    Filed: August 15, 2012
    Publication date: February 21, 2013
    Applicant: Harman Becker Automotive Systems GmbH
    Inventors: Alois Karl, Werner Pollak, Dieter Acker
  • Patent number: 4572848
    Abstract: Silicon-infiltrated, reaction-bonded silicon carbide molded bodies for application in machine building are produced by means of a siliconizing apparatus, comprising a graphite plate coated with boron nitride, a porous silicon carbide plate coated with a layer of boron nitride, silicon carbide and carbon and a layer of lumpy metallic silicon inserted between the two plates. Furthermore, following the heating and solidification of the liquid silicon, wherein due to the increase in volume of the silicon, beads of silicon appear at the surface of the molded body, these may be easily removed when the infiltrated silicon carbide molded bodies are cooled in a nitrogen atmosphere.
    Type: Grant
    Filed: July 27, 1984
    Date of Patent: February 25, 1986
    Assignee: Hoechst CeramTec Aktiengesellschaft
    Inventors: Werner Pollak, Michael Blecha, Gerhard Specht