Patents by Inventor Werner Rollett

Werner Rollett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED module
    Patent number: 11417583
    Abstract: An LED module is disclosed. In an embodiment an LED module includes a thermally conductive substrate made of a multilayer ceramic, at least one LED on the substrate, passive SMD components arranged on the substrate, a passive component integrated in the substrate and a heat spreader configured to dissipate waste heat in horizontal and vertical directions.
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: August 16, 2022
    Assignee: TDK ELECTRONICS AG
    Inventors: Thomas Feichtinger, Franz Rinner, Werner Rollett
  • LED Module
    Publication number: 20200294981
    Abstract: An LED module is disclosed. In an embodiment an LED module includes a thermally conductive substrate made of a multilayer ceramic, at least one LED on the substrate, passive SMD components arranged on the substrate, a passive component integrated in the substrate and a heat spreader configured to dissipate waste heat in horizontal and vertical directions.
    Type: Application
    Filed: August 10, 2018
    Publication date: September 17, 2020
    Inventors: Thomas Feichtinger, Franz Rinner, Werner Rollett
  • Multi-Layer Carrier System, Method for Producing a Multi-Layer Carrier System and Use of a Multi-Layer Carrier System
    Publication number: 20190131208
    Abstract: A multi-layer carrier system and a method for producing a multi-layer carrier system are disclosed. In an embodiment a multi-layer carrier system includes at least one multi-layer ceramic substrate and at least one matrix module of heat-producing semiconductor components, wherein the semiconductor components are arranged on the multi-layer ceramic substrate, and wherein the matrix module is electrically conductively connected to a driver circuit by way of the multi-layer ceramic substrate.
    Type: Application
    Filed: February 16, 2017
    Publication date: May 2, 2019
    Applicant: EPCOS AG
    Inventors: Thomas Feichtinger, Franz Rinner, Günter Pudmich, Werner Rollett, Michael Weilguni