Abstract: The invention relates to an apparatus (1, 101, 201) for electrochemically coating a workpiece (22), including a coating reservoir (2, 102, 202) with a charge opening (5) and a supply reservoir (3, 103, 203), wherein the two reservoirs are in communication through a passage opening (4, 104, 204). The apparatus has at least one electrode (11) and one counter electrode (14). In order to prevent contamination of a coating liquid (20, 120, 220) during an electrochemical deposition process, the apparatus can be switched between a coating position and a rest position by rotating the supply and the coating reservoirs about at least one common axis (A, A?, A?) so that the center of gravity of the volume of the coating reservoir (2, 102, 202) in the coating position is lower in relation to the center of gravity of the volume of the supply reservoir (3, 103, 203) than in the rest position. The invention further relates to a method for coating workpieces.

Abstract: An apparatus for electrolytically coating small parts, e.g. by electrophoretic deposition from a liquid coating agent, has a screw-type conveyor which can have a tube open at opposite ends to form an inlet and outlet for the parts which are advanced through the tube by screw conveyor means like a helical ribbon. The inlet side of the tube is immersed in a basin of the liquid coating agent whose side walls and front wall form weirs determining the level of the liquid coating agent in the tube while the liquid passes from the tube into a catch basin beyond the rear wall through perforations in the tube. The contacts traversing the tube wall are electrically-conductively coupled to the parts and are tied to one terminal of the DC power source whose other terminal is connected to a plate immersed in the dipping basin.

Abstract: The invention relates to an apparatus for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the apparatus is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously.

Abstract: A process for the electrostatic lacquering of printed circuit boards formed with continuous holes as soldering places for connecting wires. The characterizing feature of the process is that the printed circuit boards, continuously conveyed in a suspended position, are lacquered on one side, then turned over, lacquered on the other side, and the two layers of lacquer are then immediately dried simultaneously. An apparatus for the electrostatic lacquering of printed circuit boards is also disclosed.