Abstract: A mechanism for processing tapepaks by cutting an outer frame from a component, bending the terminal legs to the desired configuration, and then transferring the processed component to a transfer station for removal by a suction device. The mechanism includes a supply station, a processing station and a transfer station. The processing station includes a punch coacting with a cut-out tool having at least one blanking die receiving a bending insert and includes a slide which is movable between the punch and cut-out tool, which slide supports a bend-transfer insert and also has a tapepak holder spaced therefrom so that when the tapepak holder is at the processing station, the bend-transfer insert is at the transfer station and in a second position of the slide with the bend-transfer insert at the processing station, the holder is at the supply station.

Abstract: A method and apparatus for equipping micropacks on a substrate wherein the micropacks are supplied on a band from a supply reel and are cut from the band in a cut-out device. As the micropack is cut, a suction pipette or suction head of a positioning device engages the micropack as it is cut so that the orientation of the cut micropack is always known. The method and apparatus may include a bending or shaping of the external contacts of the micropack prior to the micropack being cut from the band.