Patents by Inventor Werner Uggowitzer

Werner Uggowitzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for manufacturing a printed circuit board and printed circuit board
    Patent number: 5560795
    Abstract: Producing a printed circuit board having at least two layers and having a carrier board, a first Conductor layer having contact areas and a second conductor layer having connecting areas, in which a conductive foil, provided with an adhesive coating, is laminated onto the carrier board having the first conductor layer and the contact areas, the adhesive coating an the conductive foal having holes which correspond with the contact areas of the first conductor layer.
    Type: Grant
    Filed: August 2, 1994
    Date of Patent: October 1, 1996
    Assignee: Philips Electronics N.V.
    Inventors: Helmut Bruckner, Siegfried Kopnick, Werner Uggowitzer
  • Method of manufacturing a multilayer printed circuit board having first and second conducting patterns connected through an adhesive layer and laminate for the manufacture of such a printed circuit board
    Patent number: 5525181
    Abstract: Two-layer or multilayer printed circuit board, method of manufacturing such a printed circuit board, and laminate for the manufacture of such a printed circuit board by such a method.A two-layer or multilayer printed circuit board (1) comprises a support plate (2) which consists of a basic material and which carries a first conductor pattern (3) and a second conductor pattern (17) connected to the support plate (2) via an adhesive layer (11)consisting of an electrically insulating adhesive material. At least one opening (12, 13) is provided in the adhesive layer (1 1), which opening leads to a connecting section (4, 5) of the first conductor pattern (3) and to which a connecting section (18, 19) of the second conductor pattern (17) extends, and by means of which the connecting sections (4, 5, 18, 19) of the two conductor patterns (3, 17) can be electrically interconnected by means of an electrically conducting material connection (28, 29).
    Type: Grant
    Filed: September 22, 1994
    Date of Patent: June 11, 1996
    Assignee: U.S. Philips Corporation
    Inventors: Helmut Bruckner, Siegfried Kopnick, Werner Uggowitzer
  • Two-layer or multilayer printed circuit board
    Patent number: 5403978
    Abstract: A two-layer or multilayer printed circuit board (1) comprises a support plate (2) carrying a first conductor pattern (3) and a second conductor pattern (21) which is connected to the support plate (2) via an adhesive layer (13) consisting of adhesive material, a solder-stop layer (30) being applied to the second conductor pattern.
    Type: Grant
    Filed: October 27, 1992
    Date of Patent: April 4, 1995
    Assignee: U.S. Philips Corporation
    Inventors: Rudolf Drabek, Werner Uggowitzer
  • Two-layer or multilayer printed circuit board
    Patent number: 5378858
    Abstract: A two-layer or multilayer printed circuit board (1) comprises a support plate (2) which consists of a basic material and which carries a first conductor pattern (3) and a second conductor pattern (17) connected to the support plate (2) via an adhesive layer (11) consisting of an electrically insulating adhesive material. At least one opening (12, 13) is provided in the adhesive layer (11), which opening leads to a connecting section (4, 5) of the first conductor pattern (3) and to which a connecting section (18, 19) of the second conductor pattern (17) extends, and by means of which the connecting sections (4, 5, 18, 19) of the two conductor patterns (3, 17) can be electrically interconnected by means of an electrically conducting material connection (28, 29).
    Type: Grant
    Filed: October 27, 1992
    Date of Patent: January 3, 1995
    Assignee: U.S. Philips Corporation
    Inventors: Helmut Bruckner, Siegfried Kopnick, Werner Uggowitzer
  • Board for printed circuits and processes for manufacturing such printed boards
    Patent number: 4766268
    Abstract: A printed circuit board, in which the substrate (1) and interconnections (2) are masked by a solder-resistant lacquer mask consisting of two layers of lacquer (4,5), the lands (3) being left unmasked, one layer of lacquer (4), which extends to the edges of the lands (3) and directly masks the substrate (1), is provided at least in the region of the lands (3), and the other layer of lacquer (5) masks the interconnections (2), while leaving the lands (3) unmasked, and extends to the region occupied by the layer of lacquer (4) extending to the edges of the lands (3) the two layers overlapping.
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: August 23, 1988
    Assignee: U.S. Philips Corporation
    Inventor: Werner Uggowitzer