Abstract: A method for producing a lithography optical system having an optical component with an optically active surface and a substrate includes: 1) providing (S2), for a substrate of one or more optical components, a respective normalized distribution function (g, ha, hb, hc) of a zero crossing temperature (ZCT?, ZCTa, ZCTb, ZCTc) of a coefficient of thermal expansion of the respective substrate as a function of a location of the substrate, b) computer-implemented determining (S3), for each provided distribution function and for a plurality of predetermined mean zero crossing temperatures (Mj) different from each other, an imaging error (Fi) of the optical component and c) determining (S4) at least one selected mean zero-crossing temperature (Maw) for the substrate of the optical component to be produced as that one of the plurality of mean zero-crossing temperatures for which the determined imaging error (Fi) is smaller than a predetermined threshold value (SW).

Abstract: A mirror system comprises an EUV mirror, a temperature sensor, a control unit and a temperature-control module. The EUV mirror has a mirror body and an optical surface on the mirror body. The temperature sensor determines a measured temperature value via the temperature of the mirror body and transmits the measured temperature value to the control unit. The temperature-control module is actuated by control commands so that the temperature-control module influences the temperature of the mirror body. In a first operating state of the mirror system, the control unit determines the control commands by processing a first temperature setpoint value for the temperature of the mirror body. In a second operating state of the mirror system, the control unit determines the control commands by processing a second temperature setpoint value for the temperature of the mirror body.

Abstract: A method for reducing aberrations of an optical element (Mi) e.g., in a lithography system includes: determining a temporal change in an optical property of the optical element (Mi), e.g., a temporal change of a surface FIGURE(P(x,y)) of a surface (24a) of a substrate (24) of the optical element (Mi), that is expected over the operational life of the optical element (Mi), with the temporal change in the optical property over the operational life (T) of the optical element (Mi) causing varying aberrations, and reducing the aberrations that vary over the operational life of the optical element (Mi) by generating an allowance, in particular a surface figure allowance (?PV), which compensates at least a portion of the total temporal change in the optical property (P(x,y)) that is expected over the operational life.

Abstract: A method for heating an optical element in an optical system, such as a microlithographic projection exposure system, comprises introducing a heating power into the optical element using a thermal manipulator. The heating power is adjusted to a set of desired values. The set of desired values is adjusted to produce a thermally induced deformation depending on a first optical aberration to be compensated. Adjusting the set of desired values also includes taking into account the effect of introducing the heating power on a second optical aberration which is caused by useful light impinging on the optical element during operation of the optical system. The thermally induced deformation profile can be co-optimized.

Abstract: A method for heating an optical element in an optical system, such as in a microlithographic projection exposure system comprises using a thermal manipulator to introduce a heating power into the optical element to produce a thermally induced deformation. Before starting operation of the optical system in which useful light impinges on the optical element, the heating power is adjusted with respect to a desired state of the optical element in which a first optical aberration is at least partially compensated. After starting operation of the optical system, the heating power is regulated to the desired state depending on the heat load of the useful light impinging on the optical element. The heating power is regulated in such a way that the average temperature of the optical element remains constant up to a maximum deviation of 0.5 K.

Abstract: A method of operating a projection exposure apparatus for microlithography, comprises: heating an optical element of the projection exposure apparatus by irradiating a surface of the optical element with heating radiation during a break in operation in which the surface of the optical element is not irradiated by exposure radiation. An inhomogeneous temperature distribution which reduces aberrations of the projection exposure apparatus is created on a portion of the surface of the optical element during the heating in the break in operation, with the inhomogeneous temperature distribution being created by irradiating the portion with heating radiation with at least one continuous heating radiation profile formed by a beam shaping element. A related projection exposure apparatus for microlithography is disclosed.

Abstract: A high-lift system of an aircraft has at least one drive unit, at least one load station as well as one or more transmissions for transmitting the drive energy of the drive unit to the at least one load station. One or more of the transmissions are made as transmission shafts from a material containing titanium or include a material containing titanium.

Abstract: The present invention relates to a high-lift system of an aircraft having at least one drive unit, having at least one load station as well as having one or more transmissions for transmitting the drive energy of the drive unit to the at least one load station, wherein one or more of the transmission are made as transmission shafts which consist of a material containing titanium or comprise a material containing titanium.

Abstract: A high current end power stage comprises at least four power transistors, two electrical supply lines and a safety fuse. The at least four power transistors have each a diode which is blocked during normal operation of the respective power transistor. The two electrical supply lines couple the at least four power transistors with a supply potential and a reference potential such that two of the at least four power transistors are connected electrically between the supply potential and the reference potential. The safety fuse is connected in series to the at least four power transistors in at least one of the two electrical supply lines. The at least one safety fuse can be triggered by a current which flows through the diode of the at least four power transistors, said diode being then arranged in the direction of conduction, when the supply potential and reference potential are exchanged.

Abstract: A high current end power stage (PA) comprises at least four power transistors (T), two electrical supply lines and at least a safety fuse (S). The at least four power transistors (T) have each a diode (D) which is blocked during normal operation of the respective power transistor (T). The two electrical supply lines couple the at least four power transistors (T) with a supply potential (Up) and a reference potential (Un) in such a way that two of the at least four power transistors (T) are at a time connected in series to each other, to be precise connected electrically between the supply potential (Up) and the reference potential (Un). The at least one safety fuse (S) is connected in series to the at least four power transistors (T) in at least one of the two electrical supply lines.

Abstract: Below a predetermined threshold value of the rotation speed, a sinusoidal or trapezoidal current is applied to the winding sections of a brushless DC motor. Above the predetermined threshold value of the rotation speed, the brushless DC motor is operated with block commutation. The brushless DC motor thus produces a very uniform torque over a very wide operating range, and can at the same time be designed to be very compact.

Abstract: Soft quartz glass having low viscosity and a low thermal coefficient of expansion, high electrical insulation capability and free from release of contaminants, when used as a bulb of an incandescent lamp or as an envelope in an arc vessel of a discharge lamp, is a quartz glass made of ultra-pure quartz (SiO.sub.2), for example having a purity of 99.99 mol-%, doped with stoichiometric compounds of alkaline earth oxides with boron oxide, optionally also with a small quantity of Al.sub.2 O.sub.3 in an overall quantity of the doping substance of between about 0.05% to 0.8%, by weight.

Abstract: Soft quartz glass having low viscosity and a low thermal coefficient of expansion, high electrical insulation capability and free from release of contaminants, when used as a bulb of an incandescent lamp or as an envelope in an arc vessel of a discharge lamp, is a quartz glass made of ultra-pure quartz (SiO.sub.2), for example having a purity of 99.99 mol-%, doped with stoichiometric compounds of alkaline earth oxides with boron oxide, optionally also with a small quantity of Al.sub.2 O.sub.3 in an overall quantity of the doping substance of between about 0.05% to 0.8%, by weight.

Abstract: To reduce the transmissivity of glass, and particularly quartz glass, espally highly thermally loaded quartz glass of discharge lamps or halogen incandescent lamps, a coating or glaze is applied to the bulb and adjacent regions which includes, as an ultraviolet light absorption, a glaze of a mixture of cerium fluoride (CeF.sub.3) and aluminum trioxide (Al.sub.2 O.sub.3) and silicon dioxide (SiO.sub.2), in a relationship, by weight, of about 3:1, preferably about 2:1. The weight relationship of Al.sub.2 O.sub.3 to SiO.sub.2 in the mixture is about 1.7:1. The mixture can be applied in form of an alcohol or alcohol-like suspension, after grinding to a grain size of less than 300 mesh, by spraying, dripping on, painting or the like, subsequent drying for 10 seconds, and firing in a hydrogen/oxygen flame or in an ordinary gas flame for about 2 seconds, while axially rotating the lamp bulb.

Abstract: A lead oxide free glass of high electrical resistance, easy workability, that is, low abrasive characteristics, and a thermal coefficient of expansion compatible with electrical current supply leads, has an electrical resistance of 10.sup.12 ohm cm at 250.degree. C., and, basically, the following composition:SiO.sub.2 40-60%Al.sub.2 O.sub.3 2-5%CaO 5-10%BaO 20-30%V.sub.2 O.sub.5 2-5%K.sub.2 O 5-7%B.sub.2 O.sub.3 0-5%and additives comprising at least one of MgO, B.sub.2 O.sub.3, each present between 0 and about 5%.

Abstract: To provide a melt glass (10) to seal capillary spaces (9) surrounding external current supply leads (8) of molybdenum passing to molybdenum foils (6) in a pinch or press seal (7) of a high temperature, for example incandescent halogen lamp, the melt glass (10) is made of 3-10% Bi.sub.2 O.sub.3, 25%-40% B.sub.2 O.sub.3, remainder PbO. The melt glass has low toxicity and is molybdenum-compatible. An additive of barium oxide, in up to 15% and preferably up to only about 10%, may be added to the PbO. All quantities in mol-percent.

Abstract: To improve tightness of a pinch or press seal (2a; 13a, 13b) between a modenum foil and quartz or similar hard glass of an electric lamp, typically a halogen incandescent lamp or metal halide discharge lamp, an intermediate melt glass layer in form of a strip is applied to the sealing foil, which has the following main components:SiO.sub.2 : 60-70%Al.sub.2 O.sub.3 : 3-20%K.sub.2 O: 12-18,all percentages by weight, the glass being, except for trace contaminants, free from Na.sub.2 O. In a preferred form, the main components are:SiO.sub.2 : 66%Al.sub.2 O.sub.3 : 18% K.sub.2 O: 15%,all percentages by weight.

Abstract: A saw chain comprising a series of center links and pairs of side links pivotally joined to form a chain. Certain of the side links are cutter links formed without integral depth gauges. The chain further comprises special cam links bearing upstanding cam portions with upwardly and rearwardly inclined forward edges and rearwardly projecting tails. Each cutter link is preceded by a cam link disposed on the opposite side of the chain.

Abstract: A saw chain for a chain saw with kerf sidewall cutting, free end chisel raker teeth having positive cutting edge rake angles and with bifurcated cutters formed from paired, laterally opposed cutting elements wherein the free end chisel corners of the raker teeth project laterally outwardly beyond the bifurcated cutter forming elements so that the combined cutting width of two mirror image raker teeth is greater than the cutting width of the bifurcated cutters; the height of the bifurcated cutters being generally equal to or less than the height of the raker teeth; the cutting edges of each raker tooth and each bifurcated cutter being disposed rearwardly of the rearmost pivot point of the link which bears it, and the outer surfaces of the shank portions of the raker teeth and the outer surfaces of the bifurcated cutter forming elements being formed to engage the upper edges of the immediately following side links to lock each cutter bearing link against rearing back more than a specified amount.