Abstract: A known good die testing apparatus for pre-package testing singulated semiconductor die includes a plurality of test nests for receiving at least one of the singulated semiconductor die, each test nest including first and second portions which are movable away from one another to receive the singulated die, the first portion having a probe card coupled thereto which includes at least one needle for electrically connecting to a first side of the semiconductor die and at least one first edge connector electrically coupled to a respective needle; and at least one test unit in movable communication with respect to the test nests, the test unit being adapted to removably engage the first edge connector of the test nests, the test unit including at least one electrical circuit for performing electrical tests on the semiconductor die.