Abstract: The wedge clamp (28) engages on the end of a heatsink (18) and engages within a channel shaped recess (24, 26) in the coldwall. The wedge clamp (28) is made up of a pair of wedges (32, 34) of the same angle driven together by a screw (48). This forces the wedge clamp surfaces (32, 34) apart to obtain a large heat transfer area and intimate contact with the coldwall surfaces (24, 26).

Abstract: Circuit module connection system for connection of a modular package (18) to a printed wiring board (12) has a contact (24) on the package and an aligned pad (16) on the board. A resilient contact (44) is positioned therebetween and is held in place and separated from adjacent contacts by means of contact retainer (34). The contact retainer (34) also has a seal flange (40) to resiliently seal out the environment. A thermal member (42) spaces the package from the board and permits heat flow out of the package.

Abstract: A plug-in module, for supporting such electronic devices as an LSI circuit wafer, hybrid electronics, and/or discrete components, includes a ceramic base, the electronic devices mounted on one side of the base, a corrugated cooling fin bonded to the other side of the base, a printed circuit board secured to the far side of the cooling fin, a terminal strip connector at the base edge, a crossover electrically interconnecting the two module sides, and a supporting slotted frame onto which the ceramic base and printed wiring board are bonded. The terminal strip connector is secured to the frame with screws. Circuit leads from the ceramic base are soldered directly to the terminal strip connector and also are interconnected to the terminal strip by means of soldered crossover leads and vertical conductor lines on the printed circuit board. If the module's electronic function so requires, further electronic devices may be placed on the printed circuit board.