Abstract: An enclosure arrangement includes a chassis, and a central electronics complex. The central electronics complex has a cage removably positioned within the chassis. The cage has an open top providing access into the interior of the cage. The central electronics complex also includes a backplane arranged in a horizontal position, and forming a floor of the cage. The backplane has at least one card slot on a surface thereof. The central electronics complex further includes at least one circuit board disposed in the interior of the cage and being removably received by the card slot. The circuit board is arranged in a vertical position so that a gravitational force helps retain the circuit board in the card slot. The cage is removably positioned within the chassis. At least one rail connects the cage to the chassis. The cage is disposed on the rail, and is guidable into the chassis using the rail.

Abstract: A snap-fit shield is provided which fits securely within a frame opening, and which shields and grounds the opening while allowing cables to pass therethrough. The shield has a plurality of front extensions, a plurality of front flanges and a plurality of back extensions. The shield is designed to fit tightly within the frame opening, such that the back extensions contact an internal cage and thereby bias the shield forward toward the frame. An outward biasing mechanism is provided to contact the inner surface of the frame opening so as to limit the shield's forward movement. The combined action of the backward extensions and the outward biasing mechanism limits both the shield's forward and backward movement. The front flanges may be used to indicate proper shield positioning, and the front extensions are preferably easily deflected to facilitate shield insertion and removal.

Abstract: A computer arrangement includes an electronics enclosure located within a computer housing, which is divided into a plurality of physically separated cooling zones. The enclosure has a plurality of inlet and outlet openings. Each cooling zone is in registration with respective inlet and outlet openings. A backplane is disposed within the electronics enclosure, and has front and rear surfaces. A first electrical component is attached to one of the surfaces and is arranged in one of the cooling zones. At least one circuit board is disposed within the electronics enclosure and is attached to the front surface of the backplane. The circuit board has a second electrical component attached to a surface thereof, which is arranged in another one of the cooling zones. A system operation card is disposed within the electronics enclosure, and is attached to the rear surface of the backplane.