Abstract: A method of registering a molded lenslet array (14) with an array of light emitting elements (54) includes etching an array of light source registration recesses (42) in a silicon pad (28). At least two registration recesses (30) are etched in the silicon pad. The registration recesses and the light source registration recesses have the same depth. Sidewalls of the registration recesses and the light source registration recesses have the same slope angle. A light emitting element is located in at least one of the light source registration recesses. The molded lenslet array is located at a predetermined distance from the bottom of the registration recesses (36). The molded lenslet array which is in a x-direction is located by matching a tapered locating surface of a first and second registration pin (72, 74) to a first and second tapered locating surface (68, 70) of a first and second registration recess (76, 78).

Abstract: An imaging apparatus (10) having a multiple channel image exposure device (12). Improved thermal compensation is achieved by means of mounting an array of light emitting elements (30) on a printed circuit board (28) having at least one thermal via (26) for each light emitting element to thermally control the temperature of the light emitting element. Selected microcapsules (38) within a photosensitive media (44) are exposed with the multiple channel image exposure device to harden the desired microcapsules. Pressure applied to the exposed photosensitive media ruptures the unexposed microcapsule (40), releasing the image-forming material (48) encapsulated within to form an image on the photosensitive media.

Abstract: An electro-optic modulator array (36). Electrode pairs 50 and 51 are mounted on a substrate (40). A layer of electronic grade glass (60) is deposited by electron beam evaporation on the substrate (40) and electrodes (50) and (51). In an alternate embodiment, an electronic grade of glass 50 is deposited on the PLZT substrate (40) prior to applying electrodes (50) and (51).

Abstract: A laser print head structure includes a laser diode array (14) coupled to a heat sink (10). A cylindrical lens element (20) is aligned with the laser diode array and bonded to the heat sink. A binary optical element (22) is then aligned with the cylindrical lens element and attached to the heat sink through the use of flexures (24). The use of the flexures permits the binary optical element to "float" in the plane of the laser diode array, thereby maintaining alignment even when the thermal expansion characteristics of the binary optical element are different from the thermal expansion characteristics of the heat sink. Anti-wicking slots (18) are provided in the heat sink at locations between the bonding points of the cylindrical lens element and the laser diode array. The anti-wicking slots, through capillary action, prevent excess adhesive from wicking along the cylindrical lens element and onto the facets of the lasers in the laser diode array.

Abstract: In a microbump flip-chip mounting method, microcircuit features such as conductors and microbumps are formed by a lift off process. A first refractory metal is employed to promote adhesion between a layer of aluminum deposited by physical vapor deposition and a second refractory metal is employed to promote adhesion between the aluminum and an overlying layer of gold.

Abstract: An LED array printhead comprises an elongate support bar of generally rectangular cross section with a row of LED array chips mounted end-to-end along one of the narrow elongate edge faces of the bar. The bar is sandwiched between heat sink members confronting its wide faces. The heat sink members dissipate heat from the bar and also support circuit board means electrically connected to the LED chips.