Patents by Inventor Wesley J. Louie

Wesley J. Louie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High temperature resistant thin-film system
    Patent number: 6291889
    Abstract: A thin-film microcircuit resistant to high temperatures comprises a substrate fabricated of high-purity, densely packed alumina ceramic with a fine grain size, and metallization deposited thereon. The high temperature resistance is further improved by applying a vacuum anneal to the metallization. The present invention allows a glass fusing process to bond adjacent substrate layers together in forming a multi-layer module. The multi-layer modules integrate infrared detector arrays to signal conditioning circuitry. The prior art thin-film microcircuits were susceptible to damage from the glass fusing process, where the melting point of the glass reached 600° C.
    Type: Grant
    Filed: October 7, 1998
    Date of Patent: September 18, 2001
    Assignee: Northrop Grumman Corporation
    Inventors: Wei Koh, Wesley J. Louie
  • Process of vacuum annealing a thin film metallization on high purity alumina
    Patent number: 5856235
    Abstract: A thin-film microcircuit comprising fabricating a substrate of high-purity, densely packed alumina ceramic with a fine grain size, and metallization deposited thereon and applying a vacuum anneal to the metallization.
    Type: Grant
    Filed: April 12, 1995
    Date of Patent: January 5, 1999
    Assignee: Northrop Grumman Corporation
    Inventors: Wei NMI Koh, Wesley J. Louie